Integrated circuit package system with flexible substrate and recessed package

1. A method of manufacturing of an integrated circuit package system comprising:

providing a flexible circuit substrate having a fold;

mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and

encapsulating the integrated circuit or integrated circuit package with a recessed encapsulation having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

2. The method as claimed in claim 1 wherein:

providing the flexible circuit substrate includes providing a flexible circuit substrate with a base and mounting an integrated circuit package thereto.

3. The method as claimed in claim 1 wherein:

mounting the integrated circuit includes mounting a wire-bonded die; and further comprising:

mounting a spacer above the wire-bonded die; and

mounting an interposer above the spacer.

4. The method as claimed in claim 1 further comprising:

mounting passive components on a fold of the flexible circuit substrate, above the flexible circuit substrate, or on the base.

5. The method as claimed in claim 1 wherein:

providing the flexible circuit substrate includes folding the flexible circuit substrate over the first level of the recessed encapsulation and over an integrated circuit package mounted to the first level of the recessed encapsulation.

6. A method of manufacturing of an integrated circuit package system comprising:

providing a flexible circuit substrate having two folds;

mounting an integrated circuit or an integrated circuit package over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects;

mounting passive components over the flexible circuit substrate;

encapsulating the integrated circuit or integrated circuit package within a recessed encapsulation under a first level and encapsulating the passive components under a second level, the second level having the flexible circuit substrate folded thereover; and

mounting a pre-mold integrated circuit or an integrated circuit package above the second level of the recessed encapsulation and connected to the flexible circuit substrate.

7. The method as claimed in claim 6 wherein:

mounting the integrated circuit or the integrated circuit package over the flexible circuit substrate includes mounting a wire-bonded die, or a flip chip, or a pre-mold package, or an inner stacking module over the flexible circuit substrate.

8. The method as claimed in claim 6 further comprising:

mounting a silicon interposer having through silicon vias and microbumps over the integrated circuit package and connected to the integrated circuit package with the microbumps.

9. The method as claimed in claim 6 further comprising:

mounting an integrated circuit package bridging the recessed encapsulation and connected to the flexible circuit substrate above the second level of the recessed encapsulation with solder ball interconnects.

10. The method as claimed in claim 6 wherein:

folding the flexible circuit substrate over the second level includes:

attaching the flexible circuit substrate to the second level with die attach adhesive; or

folding the flexible circuit substrate over the second level and over an integrated circuit package.

11. An integrated circuit package system comprising:

a flexible circuit substrate;

an integrated circuit or an integrated circuit package mounted over the flexible circuit substrate and connected to the flexible circuit substrate with interconnects; and

a recessed encapsulation encapsulating the integrated circuit or integrated circuit package having a first level and a second level, the second level having the flexible circuit substrate folded thereover.

12. The system as claimed in claim 11 wherein:

the flexible circuit substrate has a base and an integrated circuit package is mounted thereto.

13. The system as claimed in claim 11 wherein:

the integrated circuit is a wire-bonded die; and further comprising:

a spacer mounted above the wire-bonded die; and

an interposer mounted above the spacer.

14. The system as claimed in claim 11 further comprising:

passive components mounted on a fold of the flexible circuit substrate, above the flexible circuit substrate, or on the base.

15. The system as claimed in claim 11 wherein:

the flexible circuit substrate is folded over the first level of the recessed encapsulation and over an integrated circuit package mounted to the first level of the recessed encapsulation.

16. The system as claimed in claim 11 further comprising:

passive components mounted over the flexible circuit substrate;

a pre-mold integrated circuit, or an integrated circuit package mounted above the second level of the recessed encapsulation and connected to the flexible circuit substrate; and

wherein:

the integrated circuit or integrated circuit package is encapsulated within the recessed encapsulation under the first level and the passive components are encapsulated under the second level.

17. The system as claimed in claim 16 wherein:

the integrated circuit or the integrated circuit package is a wire-bonded die, or a flip chip, or a pre-mold package, or an inner stacking module mounted over the flexible circuit substrate.

18. The system as claimed in claim 16 further comprising:

a silicon interposer having through silicon vias and microbumps mounted over the integrated circuit package and connected to the integrated circuit package with the microbumps.

19. The system as claimed in claim 16 further comprising:

an integrated circuit package bridging the recessed encapsulation and connected to the flexible circuit substrate above the second level of the recessed encapsulation with solder ball interconnects.

20. The system as claimed in claim 16 wherein:

the flexible circuit substrate folded over the second level includes:

the flexible circuit substrate attached to the second level with die attach adhesive; or

the flexible circuit substrate folded over the second level and over an integrated circuit package.