Integrated circuit package system stackable devices

1. A method for manufacturing an integrated circuit package system comprising:

providing a filler;

forming a finger lead covering the filler and having a side with an outward exposed area and an inward exposed area separated by a lead cavity formed by the filler and having an internal lead surface on the side opposite the lead cavity;

forming a second coating layer on a side opposite the outward exposed area and the inward exposed area;

positioning a chip adjacent the finger lead and connected with connectors to the internal lead surface of the finger lead; and

applying a stack encapsulant over the chip, the connectors, and the finger lead with the outward exposed area and the inward exposed area substantially exposed.

2. The method as claimed in claim 1 further comprising connecting a base module having a die with the outward exposed area of the finger lead.

3. The method as claimed in claim 1 further comprising forming a conductive layer over the lead cavity wherein the filler is substantially exposed adjacent the stack encapsulant.

4. The method as claimed in claim 1 wherein providing the finger lead includes forming a plurality of the finger leads with each having a different structural shape, adjacent a side of the chip with the inward exposed area closer together than the outward exposed area.

5. An integrated circuit package system comprising:

a filler;

a finger lead covering the filler and having a side with an outward exposed area and an inward exposed area separated by a lead cavity formed by the filler;

a conductive layer over the lead cavity;

a chip positioned adjacent the finger lead and connected to the finger lead; and

a stack encapsulant applied over the chip and the finger lead with the outward exposed area and the inward exposed area of the finger lead substantially exposed.

6. The system as claimed in claim 5 further comprising a base module connected with the outward exposed area of the finger lead.

7. The system as claimed in claim 5 further comprising a first coating layer formed on the outward exposed area and the inward exposed area.

8. The system as claimed in claim 5 wherein a plurality of the finger leads formed adjacent a side of the chip with the inward exposed area closer together than the outward exposed area.

9. The system as claimed in claim 5 wherein:

the finger lead having a side with the outward exposed area and the inwards exposed area separated by the lead cavity and having an internal lead surface on the side opposite the lead cavity;

the chip adjacent the finger lead and connected with connectors to the internal lead surface of the finder lead; and

the stack encapsulant applied over the chip, the connectors, and the finger lead with the outward exposed area and the inward exposed area substantially exposed.

10. The system as claimed in claim 9 further comprising a base module having a die connected with the outward exposed area of the finger lead.

11. The system as claimed in claim 9 further comprising a conductive layer over the lead cavity adjacent the stack encapsulant.

12. The system as claimed in claim 9 wherein a plurality of the finger leads is each formed having a different structural shape, adjacent a side of the chip with the inward exposed area closer together than the outward exposed area.

13. The system as claimed in claim 9 further comprising a second coating layer formed on a side opposite the outward exposed area and the inward exposed area.

14. A method of manufacturing an integrated circuit package system comprising:

providing a filler;

forming a finger lead covering the filler and having a side with an outward exposed area and an inward exposed area separated by a lead cavity formed by the filler;

forming a conductive layer over the lead cavity;

positioning a chip adjacent the finder lead and connected to the finger lead; and

a stack encapsulant encapsulating the chip and the finder lead with the outward exposed area and the inward exposed area of the finger lead substantially exposed.

15. The method as claimed in claim 14 further comprising connecting a base module with the outward exposed area of the finger lead.

16. The method as claimed in claim 14 further comprising forming a first coating layer on the outward exposed area and the inward exposed area.

17. The method as claimed in claim 14 wherein providing the finer lead includes forming a plurality of the finder leads adjacent a side of the chip with the inward exposed area closer together than the outward exposed area.