Fan-in interposer on lead frame for an integrated circuit package on package system

1. A method of manufacture of an integrated circuit package on package system comprising:

providing a lead;

connecting a wire-bonded die to the lead with a first bond wire therebetween;

mounting a fan-in interposer over the wire-bonded die and the first bond wire with an adhesive in direct contact with the fan-in interposer and the lead;

connecting the fan-in interposer to the lead with a second bond wire; and

forming an encapsulation encapsulating the wire-bonded die, the first bond wire, the second bond wire, and the fan-in interposer leaving a portion of the fan-in interposer exposed.

2. The method as claimed in claim 1 further comprising:

mounting a die pad below the wire-bonded die and attached thereto with a die attach adhesive;

attaching a second wire-bonded die below the die pad with the die attach adhesive; and

connecting the second wire-bonded die to the lead with a third bond wire.

3. The method as claimed in claim 1 further comprising:

mounting a die pad below the wire-bonded die and attached thereto with a die attach adhesive; and

encapsulating the die pad partially with the encapsulation.

4. The method as claimed in claim 1 further comprising:

mounting a die pad below the wire-bonded die and attached thereto with a die attach adhesive; and

encapsulating the die pad fully by the encapsulation.

5. The method as claimed in claim 1 further comprising:

mounting a die pad below the wire-bonded die; and

encapsulating the die pad partially with the die pad extending below encapsulation.

6. A method of manufacture of an integrated circuit package on package system comprising:

providing a lead;

connecting a wire-bonded die to the lead with a first bond wire therebetween;

attaching a fan-in interposer to the wire-bonded die and the lead with an adhesive in direct contact with the fan-in interposer and the lead;

connecting the fan-in interposer to the lead with a second bond wire;

forming an encapsulation encapsulating the wire-bonded die, the first bond wire, the second bond wire, and the fan-in interposer leaving a portion of the fan-in interposer exposed;

bending the lead extending from an outer edge of the encapsulation; and

mounting an external device above the fan-in interposer.

7. The method as claimed in claim 6 wherein:

bending the lead includes bending the lead away from the fan-in interposer and away from the encapsulation.

8. The method as claimed in claim 6 wherein:

bending the lead includes bending the lead toward the fan-in interposer and away from the encapsulation.

9. The method as claimed in claim 6 wherein:

attaching the fan-in interposer to the wire-bonded die includes mounting the wire-bonded die with the active side facing away from the wire-in-film adhesive.

10. The method as claimed in claim 6 wherein:

mounting the external device above the fan-in interposer includes connecting the external device to the fan-in interposer with solder balls.

11. An integrated circuit package on package system comprising:

a lead;

a wire-bonded die connected to the lead;

a first bond wire connected between the wire-bonded die and the lead;

a fan-in interposer mounted over the wire-bonded die and the first bond wire;

an adhesive in direct contact with the fan-in interposer and the lead;

a second bond wire connecting the fan-in interposer to the lead; and

an encapsulation encapsulating the wire-bonded die, the first bond wire, and the fan-in interposer leaving a portion of the fan-in interposer exposed.

12. The system as claimed in claim 11 further comprising:

a die pad mounted below the wire-bonded die and attached thereto;

a die attach adhesive attaching the die pad and the wire-bonded die;

a second wire-bonded die attached below the die pad with the die attach adhesive; and

a third bond wire connecting the second wire-bonded die to the lead.

13. The system as claimed in claim 11 further comprising:

a die pad mounted below the wire-bonded die and attached thereto;

a die attach adhesive connecting the die pad and the wire-bonded die; and

wherein:

the die pad is partially encapsulated with the encapsulation.

14. The system as claimed in claim 11 further comprising:

a die pad mounted below the wire-bonded die and attached thereto;

a die attach adhesive attaching the die pad and the wire-bonded die; and

wherein:

the die pad is fully encapsulated by the encapsulation.

15. The system as claimed in claim 11 further comprising:

a die pad mounted below the wire-bonded die and extending below the encapsulation.

16. The system as claimed in claim 11 further comprising:

an external device mounted above the fan-in interposer; and

wherein:

the leads are bent and extend from an outer edge of the encapsulation.

17. The system as claimed in claim 16 wherein:

the leads are bent away from the fan-in interposer and bent away from the encapsulation.

18. The system as claimed in claim 16 wherein:

the leads are bent toward the fan-in interposer and bent away from the encapsulation.

19. The system as claimed in claim 16 wherein:

the wire-bonded die has the active side facing away from the wire-in-film adhesive.

20. The system as claimed in claim 16 further comprising:

a solder ball connects the external device to the fan-in interposer.