Integrated circuit package system
View Patent ↗An integrated circuit package system includes: mounting a first integrated circuit over a carrier; mounting an interposer, having an opening, over the first integrated circuit and the carrier with the interposer having an overhang over the carrier; connecting an internal interconnect, through the opening, between the carrier and the interposer; and forming an encapsulation over the first integrated circuit, the internal interconnect, and the carrier.
1. A method for manufacturing an integrated circuit package system comprising:
providing a carrier;
mounting a first integrated circuit over the carrier;
attaching an internal interconnect to the first integrated circuit and the carrier;
mounting a second integrated circuit over the first integrated circuit with an adhesive around a portion of the internal interconnect and facing the first integrated circuit on a side opposite the carrier;
mounting an interposer, having an opening, over the second integrated circuit on a side opposite the first integrated circuit, the interposer having an overhang over the carrier, the carrier extending laterally beyond the opening;
connecting a second internal interconnect, through the opening, between the carrier and the interposer; and
forming an encapsulation over the first integrated circuit, the second internal interconnect, and the carrier.
2. The method as claimed in claim 1 wherein forming the encapsulation includes filling the opening of the interposer with the encapsulation.
3. The method as claimed in claim 1 further comprising mounting a device below the overhang of the interposer.
4. The method as claimed in claim 1 further comprising mounting a device over the interposer.
5. The method as claimed in claim 1 wherein connecting the second internal interconnect includes connecting the second internal interconnect through the opening and between the carrier and a top side of the interposer.
6. A method for manufacturing an integrated circuit package system comprising:
providing a carrier;
mounting a first integrated circuit over the carrier;
attaching an internal interconnect to the first integrated circuit and the carrier;
mounting a second integrated circuit over the first integrated circuit with an adhesive around a portion of the internal interconnect and facing the first integrated circuit on a side opposite the carrier;
mounting an interposer, having an opening, over the second integrated circuit on a side opposite the first integrated circuit, the interposer having an overhang over the carrier, the carrier extending laterally beyond the opening;
connecting a second internal interconnect, through the opening, between the carrier and the interposer; and
forming an encapsulation over the first integrated circuit, the second internal interconnect, and the carrier with the interposer having the overhang over the encapsulation.
7. The method as claimed in claim 6 wherein forming the encapsulation includes forming an encapsulation protrusion.
8. The method as claimed in claim 6 further comprising mounting a device over the overhang of the interposer.
9. The method as claimed in claim 6 further comprising:
mounting a first device over the interposer; and
mounting a second device over the overhang of the interposer.
10. The method as claimed in claim 6 further comprising:
mounting an internal device under the interposer; and
wherein forming the encapsulation includes:
covering the internal device with the encapsulation.
11. An integrated circuit package system comprising:
a carrier;
a first integrated circuit over the carrier;
an internal interconnect attached to the first integrated circuit and the carrier;
a second integrated circuit over the first integrated circuit with an adhesive around a portion of the internal interconnect and facing the first integrated circuit on a side opposite the carrier;
an interposer, having an opening, over the second integrated circuit on a side opposite the first integrated circuit, the interposer having an overhang over the carrier, the carrier extending laterally beyond the opening;
a second internal interconnect, through the opening, between the carrier and the interposer; and
an encapsulation over the first integrated circuit, the second internal interconnect, and the carrier.
12. The system as claimed in claim 11 wherein a portion of the encapsulation extends through the opening of the interposer.
13. The system as claimed in claim 11 further comprising a device below the overhang of the interposer.
14. The system as claimed in claim 11 further comprising a device over the interposer.
15. The system as claimed in claim 11 wherein the second internal interconnect includes a second internal interconnect through the opening and between the carrier and a top side of the interposer.
16. The system as claimed in claim 11 wherein the interposer has the overhang over the encapsulation.
17. The system as claimed in claim 16 wherein the encapsulation includes an encapsulation protrusion.
18. The system as claimed in claim 16 further comprising a device over the overhang of the interposer.
19. The system as claimed in claim 16 further comprising:
a first device over the interposer; and
a second device over the overhang of the interposer.
20. The system as claimed in claim 16 further comprising:
an internal device under the interposer; and
wherein the encapsulation includes the internal device therein.