Pseudo low volume reticle (PLVR) design for ASIC manufacturing
View Patent ↗A Pseudo Low Volume Reticle (PLVR) which consists of multiple design layers on a single reticle. Specifically, the reticle can include two instances of each layer in order to facilitate die-to-die inspection techniques. A scribe is wrapped around each instance of the layer, such that both the frame and active area of the chip can be inspected with the die-to-die method. The chip consists of design data for a given part. The scribe, or frame, is preferably standard data across products which is used for yield and in line testing during the chip manufacturing process. Since only one chip and scribe unit is necessary to manufacture a device at each layer, it is only necessary that one chip and scribe instance yield during the reticle manufacturing process.
1. A method of using a reticle to expose die onto a wafer, said method comprising:
providing the reticle, wherein the reticle comprises a plurality of sets of mask patterns, wherein each set comprises a plurality of mask patterns, wherein each mask pattern in a set of mask patterns is identical to each other, but is different from the mask patterns in the other at least one set of mask patterns; and
blading off at least one of the mask patterns on the reticle while using the reticle to expose at least one other mask pattern onto the wafer.
2. A method as recited in claim 1 , further comprising providing that the reticle comprises a first set of a plurality of mask patterns, wherein each mask pattern in the first set is identical to each other, and comprising a second set of a plurality of mask patterns, wherein each mask pattern in the second set is identical to each other, wherein each mask pattern in the first set is different than each mask pattern in the second set, and each mask pattern in the second set is different than each mask pattern in the first set.
3. A method as recited in claim 1 , further comprising providing that the reticle includes two instances of each of the mask patterns.
4. A method as recited in claim 1 , further comprising providing that the reticle includes a vertical scribe and a horizontal scribe proximate at least one of the mask patterns.
5. A method as recited in claim 1 , further comprising providing that the reticle includes a vertical scribe and a horizontal scribe proximate each of the mask patterns.
6. A method of using a reticle to expose die onto a wafer, said method comprising:
providing the reticle, wherein the reticle comprises a plurality of sets of mask patterns, wherein each set comprises a plurality of mask patterns, wherein each mask pattern in a set of mask patterns is identical to each other, but is different from the mask patterns in the other at least one set of mask patterns;
determining whether there is a defective mask pattern on the reticle, and blading off the defective mask pattern on the reticle while using the reticle to expose at least one other non-defective mask pattern onto the wafer.
7. A method as recited in claim 6 , further comprising providing that the reticle comprises a first set of a plurality of mask patterns, wherein each mask pattern in the first set is identical to each other, and comprising a second set of a plurality of mask patterns, wherein each mask pattern in the second set is identical to each other, wherein each mask pattern in the first set is different than each mask pattern in the second set, and each mask pattern in the second set is different than each mask pattern in the first set.
8. A method as recited in claim 6 , further comprising providing that the reticle includes two instances of each of the mask patterns.
9. A method as recited in claim 6 , further comprising providing that the reticle includes a vertical scribe and a horizontal scribe proximate at least one of the mask patterns.
10. A method as recited in claim 6 , further comprising providing that the reticle includes a vertical scribe and a horizontal scribe proximate each of the mask patterns.