Semiconductor device and method of laser-marking wafers with tape applied to its active surface

1. A method of laser-marking a semiconductor device, comprising:

providing a first carrier;

providing a semiconductor wafer having a plurality of bumps formed on contact pads disposed on an active surface of the semiconductor wafer, the bumps having a height of 250-280 micrometers;

mounting a back surface of the semiconductor wafer, opposite the active surface, to the first carrier for structural support;

applying a tape over the bumps of the semiconductor wafer, the tape having optically translucent properties and a thickness substantially equal to the height of the bumps;

providing a second carrier;

leading with the tape, mounting the semiconductor wafer to the second carrier for structural support;

removing the first carrier;

removing a portion of the backside of the semiconductor wafer while mounted to the second carrier to reduce wafer thickness by backgrinding using a mechanical grinder followed by wet etching;

removing the second carrier after reducing the wafer thickness;

laser-marking the backside of the semiconductor wafer while the tape remains applied to the bumps, wherein the tape reduces wafer warpage during laser-marking to about 0.3-0.5 millimeters; and

removing the tape from the bumps after laser-marking the backside of the semiconductor wafer.

2. The method of claim 1 , wherein the tape is made with layers of polyolefin, acrylic, and polyethylene terephthalate.

3. The method of claim 1 , wherein the tape contacts the active surface of the semiconductor wafer.

4. The method of claim 1 , further including providing a laser-marking system including an optical recognition device, control system, and laser, the optical recognition device reading patterns on the active surface through the tape to control the laser.

5. A method of making a semiconductor device, comprising:

providing a first carrier;

providing a semiconductor wafer having a plurality of bumps formed on an active surface of the semiconductor wafer;

mounting a back surface of the semiconductor wafer, opposite the active surface, to the first carrier for structural support;

applying an optically translucent tape over the bumps of the semiconductor wafer, the optically translucent tape having a thickness substantially equal to a height of the bumps;

providing a second carrier;

mounting the optically translucent tape and semiconductor wafer to the second carrier for structural support;

removing the first carrier;

removing a portion of the backside of the semiconductor wafer while mounted to the second carrier to reduce wafer thickness;

removing the second carrier after reducing the wafer thickness;

laser-marking the backside of the semiconductor wafer while the optically translucent tape remains applied to the bumps, wherein the optically translucent tape reduces wafer warpage during laser-marking to about 0.3-0.5 millimeters; and

removing the optically translucent tape after laser-marking the backside of the semiconductor wafer.

6. The method of claim 5 , wherein the optically translucent tape is made with layers of polyolefin, acrylic, and polyethylene terephthalate.

7. The method of claim 5 , wherein the optically translucent tape contacts the active surface of the semiconductor wafer.

8. The method of claim 5 , further including providing a laser-marking system including an optical recognition device, control system, and laser, the optical recognition device reading patterns on the active surface through the optically translucent tape to control the laser.

9. The method of claim 5 , wherein the height of the bumps is about 250-280 micrometers.

10. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of bumps formed on a first surface of the semiconductor wafer;

applying an optically translucent tape over the bumps of the semiconductor wafer, the optically translucent tape having a thickness substantially equal to a height of the bumps;

providing a carrier;

leading with the optically translucent tape, mounting the semiconductor wafer to the carrier for structural support;

removing a portion of a second surface of the semiconductor wafer, opposite the first surface, while mounted to the carrier to reduce wafer thickness;

removing the carrier after reducing the wafer thickness; laser-marking the second surface of the semiconductor wafer while the optically translucent tape remains applied to the first surface, wherein the optically translucent tape reduces wafer warpage during laser-marking to about 0.3-0.5 millimeters; and

removing the optically translucent tape after laser-marking the second surface of the semiconductor wafer.

11. The method of claim 10 , further including forming the plurality of bumps on contact pads disposed on the active surface of the semiconductor wafer.

12. The method of claim 10 , wherein the optically translucent tape is made with layers of polyolefin, acrylic, and polyethylene terephthalate.

13. The method of claim 10 , further including providing a laser-marking system including an optical recognition device, control system, and laser, the optical recognition device reading patterns on the first surface through the optically translucent tape to control the laser.

14. The method of claim 10 , wherein the height of the bumps is about 250-280 micrometers.

15. A method of making a semiconductor device, comprising:

providing a semiconductor wafer having a plurality of bumps formed on a first surface of the semiconductor wafer;

applying an optically translucent tape over the bumps of the semiconductor wafer, the optically translucent tape having a thickness substantially equal to a height of the bumps;

providing a first carrier;

leading with the optically translucent tape, mounting the semiconductor wafer to the first carrier for structural support;

removing a portion of a second surface of the semiconductor wafer, opposite the first surface, while mounted to the first carrier to reduce wafer thickness;

removing the first carrier after reducing the wafer thickness;

laser-marking the backside of the semiconductor wafer while the optically translucent tape remains applied to the bumps, wherein the optically translucent tape reduces wafer warpage during laser-marking to about 0.3-0.5 millimeters; and

removing the optically translucent tape from the bumps after laser-marking the backside of the semiconductor wafer.

16. The method of claim 15 , wherein the optically translucent tape includes layers of polyolefin, acrylic, and polyethylene terephthalate.

17. The method of claim 15 , further including providing a laser-marking system including an optical recognition device, control system, and laser, the optical recognition device reading patterns on the first surface through the optically translucent tape to control the laser.

18. The method of claim 15 , wherein the height of the bumps is about 250-280 micrometers.

19. The method of claim 15 , further including:

providing a second carrier;

mounting the second surface of the semiconductor wafer to the first carrier for structural support prior to applying the optically translucent tape over the bumps of the semiconductor wafer; and

removing the second carrier after mounting the optically translucent tape and semiconductor wafer to the first carrier.