Ball grid array package stacking system
A ball grid array package stacking system includes: forming a heat spreader having a centrally located access port; mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port; coupling an integrated circuit die to the substrate; and coupling a system interconnect to the integrated circuit die, the connection pad, or a combination thereof.
1. A method of manufacturing a ball grid array package stacking system comprising:
forming a heat spreader having a standoff leg and a centrally located access port;
mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port, and with a gap between the substrate and the standoff leg of the heat spreader;
coupling an integrated circuit die to the substrate; and
coupling a system interconnect through a system pad, on a bottom of the substrate and adjacent to the heat spreader, to the integrated circuit die, the connection pad, or a combination thereof.
2. The method as claimed in claim 1 further comprising coupling a stacked package to the connection pad.
3. The method as claimed in claim 1 further comprising coupling a stacked die to the connection pad.
4. The method as claimed in claim 1 further comprising coupling a discrete component to the connection pad.
5. The method as claimed in claim 1 further comprising positioning a mounted substrate in the centrally located access port.
6. A method of manufacturing a ball grid array package stacking system comprising:
forming a heat spreader having a centrally located access port including forming a standoff leg;
mounting a substrate in the heat spreader for providing a connection pad in the centrally located access port including forming an array of the connection pads, and with a gap between the substrate and the standoff leg of the heat spreader;
coupling an integrated circuit die to the substrate including connecting an electrical interconnect between the integrated circuit die and the substrate; and
coupling a system interconnect through a system pad, on a bottom of the substrate and adjacent to the heat spreader, to the integrated circuit die, the connection pad, or a combination thereof including coupling a solder ball, a solder bump, a solder column, or a stud bump.
7. The method as claimed in claim 6 further comprising coupling a stacked package to the connection pad for forming a package stack including coupling a stacked integrated circuit, the integrated circuit die, the system interconnect, or a combination thereof.
8. The method as claimed in claim 6 further comprising coupling a stacked die to the connection pad including applying a sealing material between the stacked die and the substrate.
9. The method as claimed in claim 6 further comprising coupling a discrete component to the connection pad including coupling a resistor, a capacitor, an inductor, a diode, a transistor, or a voltage regulator to the integrated circuit die, the system interconnect, or a combination thereof.
10. The method as claimed in claim 6 further comprising positioning a mounted substrate in the centrally located access port including forming a molded filler, in the centrally located access port, between the mounted substrate and the heat spreader.
11. A ball grid array package stacking system comprising:
a heat spreader having a standoff leg and a centrally located access port;
a substrate mounted in the heat spreader for providing a connection pad in the centrally located access port, and with a gap between the substrate and the standoff leg of the heat spreader;
an integrated circuit die coupled to the substrate; and
a system interconnect coupled through a system pad, on a bottom of the substrate and adjacent to the heat spreader, to the integrated circuit die, the connection pad, or a combination thereof.
12. The system as claimed in claim 11 further comprising a stacked package coupled to the connection pad.
13. The system as claimed in claim 11 further comprising a stacked die coupled to the connection pad.
14. The system as claimed in claim 11 further comprising a discrete component coupled to the connection pad.
15. The system as claimed in claim 11 further comprising a mounted substrate positioned in the centrally located access port.
16. The system as claimed in claim 11 further comprising:
an array of the connection pads in the centrally located access port;
an electrical interconnect between the integrated circuit die and the substrate; and
a solder ball, a solder bump, a solder column, or a stud bump coupled to the integrated circuit die, the connection pad, or a combination thereof.
17. The system as claimed in claim 16 further comprising a stacked package coupled to the connection pad to form a package stack includes a stacked integrated circuit, the integrated circuit die, the system interconnect, or a combination thereof electrically connected.
18. The system as claimed in claim 16 further comprising a stacked die coupled to the connection pad includes a sealing material between the stacked die and the substrate.
19. The system as claimed in claim 16 further comprising a discrete component coupled to the connection pad includes a resistor, a capacitor, an inductor, a diode, a transistor, or a voltage regulator coupled to the integrated circuit die, the system interconnect, or a combination thereof.
20. The system as claimed in claim 16 further comprising a mounted substrate positioned in the centrally located access port includes a molded filler, formed in the centrally located access port, between the mounted substrate and the heat spreader.