Integrated circuit package system with multiple molding
View Patent ↗An integrated circuit package system is provided forming a lead from a padless lead frame, and encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound.
1. A method for manufacturing an integrated circuit package system comprising:
forming a lead from a padless lead frame; and
encapsulating the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound including:
encapsulating a bottom of an inner portion of the lead of the padless lead frame with the first molding compound:
attaching the integrated circuit die on the first moiding compound with an adhesive:
connecting an electrical interconnect between the integrated circuit die and the lead: and
encapsulating the integrated circuit die, the electrical interconnect. and the inner portion of the lead with the second molding compound from a top of the inner portion of the lead.
2. The method as claimed in claim 1 wherein forming the lead from the padless lead frame comprises forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame.
3. The method as claimed in claim 1 wherein forming the lead from the padless lead frame comprises:
forming a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame; and
forming a ground ring with a connection between the support at the corner to the support at an adjacent corner.
4. An integrated circuit package system comprising:
a lead from a padless lead frame; and
the lead for supporting an integrated circuit die with a first molding compound for encapsulation with a second molding compound that includes:
a bottom of an inner portion of the lead of the padless lead frame molded with the first molding compound;
the integrated circuit die on the first molding compound with an adhesive;
an electrical interconnect between the integrated circuit die and the lead; and
the integrated circuit die, the electrical interconnect, and the inner portion of the lead molded with the second molding compound from a top of the inner portion of the lead.
5. The system as claimed in claim 4 wherein the lead for supporting the integrated circuit die with the first molding compound for encapsulation with the second molding compound comprises:
the lead of the padless lead frame having a space molded with the first molding compound;
the integrated circuit die on the first molding compound;
an electrical interconnect between the integrated circuit die and the lead; and
the integrated circuit die, the electrical interconnect, and a portion of the top of the lead molded with the second molding compound.
6. The system as claimed in claim 4 wherein the lead from the padless lead frame comprises a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame.
7. The system as claimed in claim 4 wherein the lead from the padless lead frame comprises:
a support from a corner of the padless lead frame to a diagonal corner of the padless lead frame; and
a ground ring with a connection between the support at the corner to the support at an adjacent corner.
8. The system as claimed in claim 4 wherein:
the lead from the padless lead frame is a lead finger;
the lead for supporting the integrated circuit die molded with a first molding compound for encapsulation with a second molding compound; and
further comprising:
the integrated circuit die on the first molding compound with an adhesive, and the integrated circuit die and the lead molded with the second molding compound.
9. The system as claimed in claim 8 wherein the lead from the padless lead frame comprises a support segment at a corner of the padless lead frame.
10. The system as claimed in claim 8 wherein the lead from the padless lead frame comprises:
a support segment at a corner of the padless lead frame; and
a ground ring with a connection between the support segment at the corner to the support segment at an adjacent corner.
11. The system as claimed in claim 8 further comprising an electrical interconnect between the integrated circuit die and the lead.
12. The system as claimed in claim 8 wherein the integrated circuit die, the electrical interconnect, and the lead molded with the second molding compound comprises a hermetic seal formed with the first molding compound and the second molding compound.