Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices
View Patent ↗A semiconductor wafer contains a plurality of semiconductor die each having a peripheral area around the die. A first insulating layer is formed over the die. A recessed region with angled sidewall is formed in the peripheral area. A first conductive layer is formed over the first insulating layer outside the recessed region and further into the recessed region. A conductive pillar is formed over the first conductive layer within the recessed region. A second insulating layer is formed over the first insulating layer, conductive pillar, and first conductive layer such that the conductive pillar is exposed from the second insulating layer. A dicing channel partially through the peripheral area. The semiconductor wafer undergoes backgrinding to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die. The semiconductor die can be disposed in a semiconductor package with other components and electrically interconnected through the conductive pillar.
1. A method of making a semiconductor device, comprising:
providing a semiconductor wafer having a plurality of semiconductor die with a peripheral area around the semiconductor die;
forming a first insulating layer over the semiconductor die;
forming a recessed region in the peripheral area, the recessed region having an angled sidewall;
forming a first conductive layer over the first insulating layer outside the recessed region and further into the recessed region, the first conductive layer being electrically connected to a contact pad on the semiconductor die;
forming a conductive pillar over the first conductive layer within the recessed region, the conductive pillar extending above a portion of the first conductive layer outside the peripheral area;
forming a second insulating layer over the first insulating layer, conductive pillar, and first conductive layer such that the conductive pillar is exposed from the second insulating layer;
forming a dicing channel partially through the peripheral area; and
removing a portion of a backside of the semiconductor wafer to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die.
2. The method of claim 1 , further including:
forming a plurality of conductive pillars in the recessed region; and
forming the dicing channel between the conductive pillars.
3. The method of claim 1 , further including forming the dicing channel through the conductive pillar to form a half conductive pillar.
4. The method of claim 1 , further including forming a second conductive layer over the second insulating layer, the second conductive layer being electrically connected to the conductive pillar.
5. The method of claim 1 , further including forming a conductive bump over the contact pad of the semiconductor die.
6. The method of claim 1 , wherein the angled sidewall of the recessed region includes a plurality of steps.
7. The method of claim 1 , further including disposing the semiconductor die with the conductive pillar in a semiconductor package with other semiconductor components, the semiconductor die being electrically interconnected to the other semiconductor components through the conductive pillar.
8. A method of making a semiconductor device, comprising:
providing a semiconductor wafer having a plurality of semiconductor die with a peripheral area around the semiconductor die;
forming a first insulating layer over the semiconductor wafer;
forming a recessed region in the peripheral area;
forming a first conductive layer over the first insulating layer outside the recessed region and further into the recessed region, the first conductive layer being electrically connected to a contact pad on the semiconductor die;
forming a conductive pillar over the first conductive layer within the recessed region;
forming a second insulating layer over the conductive pillar and first conductive layer; and
singulating the semiconductor wafer through the peripheral area to separate the semiconductor die.
9. The method of claim 8 , wherein the recessed region has an angled or vertical sidewall.
10. The method of claim 8 , wherein forming the conductive pillar includes forming stacked bumps.
11. The method of claim 8 , further including removing a portion of the second insulating layer to expose the conductive pillar.
12. The method of claim 8 , wherein singulating the semiconductor wafer includes:
forming a dicing channel partially through the peripheral area; and
removing a portion of a backside of the semiconductor wafer to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die.
13. The method of claim 8 , further including:
forming a plurality of conductive pillars in the recessed region; and
forming the dicing channel between the conductive pillars.
14. The method of claim 8 , further including forming a second conductive layer over the second insulating layer, the second conductive layer being electrically connected to the conductive pillar.
15. A method of making a semiconductor device, comprising:
providing a semiconductor wafer having a plurality of semiconductor die with a peripheral area around the semiconductor die;
forming a recessed region in the peripheral area;
forming a conductive layer in the recessed region;
forming a conductive pillar over the conductive layer within the recessed region;
forming an insulating layer over the conductive pillar and conductive layer; and
singulating the semiconductor wafer through the peripheral area to separate the semiconductor die.
16. The method of claim 15 , wherein the recessed region has an angled or vertical sidewall.
17. The method of claim 15 , further including forming the conductive layer over the semiconductor die outside the peripheral area.
18. The method of claim 15 , wherein forming the conductive pillar includes forming stacked bumps.
19. The method of claim 15 , further including removing a portion of the insulating layer to expose the conductive pillar.
20. The method of claim 15 , wherein singulating the semiconductor wafer includes:
forming a dicing channel partially through the peripheral area; and
removing a portion of a backside of the semiconductor wafer to the dicing channel to singulate the semiconductor wafer and separate the semiconductor die.
21. The method of claim 15 , further including:
forming a plurality of conductive pillars in the recessed region; and
forming the dicing channel between the conductive pillars.
22. The method of claim 15 , further including disposing the semiconductor die with the conductive pillar in a semiconductor package with other semiconductor components, the semiconductor die being electrically interconnected to the other semiconductor components through the conductive pillar.