Semiconductor device and method of forming compliant polymer layer between UBM and conformal dielectric layer/RDL for stress relief
View Patent ↗A semiconductor device has a first conductive layer formed over a top surface of a substrate. A first insulating layer is formed over the substrate. A first dielectric layer is formed over the first insulating layer. A second conductive layer is formed over the first conductive layer and first dielectric layer. A second dielectric layer is formed over the second conductive layer. A polymer material is deposited over the second dielectric layer and second conductive layer. A third conductive layer is formed over the polymer material and second conductive layer. The third conductive layer is electrically connected to the second conductive layer. A first solder bump is formed over the third conductive layer. A conductive via is formed through a back surface of the substrate. The conductive via is electrically connected to the first conductive layer. The polymer material has a low coefficient of thermal expansion.
1. A method of manufacturing a semiconductor device, comprising:
providing a substrate;
forming a first conductive layer over a top surface of the substrate;
forming a first insulating layer over the substrate;
forming a first conformal dielectric layer over the first insulating layer;
forming a second conductive layer over the first conductive layer and first conformal dielectric layer;
forming a second conformal dielectric layer over the second conductive layer;
depositing a compliant polymer material over the second conformal dielectric layer and second conductive layer;
forming a third conductive layer over the compliant polymer material and second conductive layer, the third conductive layer being electrically connected to the second conductive layer; and
forming a first solder bump over the third conductive layer.
2. The method of claim 1 , further including removing a portion of the compliant polymer material over the second conformal dielectric layer.
3. The method of claim 1 , further including forming a conductive via through a back surface of the substrate, opposite the top surface of the substrate, the conductive via being electrically connected to the first conductive layer.
4. The method of claim 3 , wherein the conductive via has vertical or tapered sidewalls.
5. The method of claim 3 , further including forming a second solder bump over the conductive via.
6. The method of claim 3 , further including:
forming a fourth conductive layer over the back surface of the substrate and into the conductive via, the fourth conductive layer being electrically connected to the first conductive layer;
forming a second insulating layer over the fourth conductive layer;
removing a portion of the second insulating layer to expose the fourth conductive layer; and
forming a second solder bump over the fourth conductive layer.
7. The method of claim 1 , wherein the compliant polymer material has a coefficient of thermal expansion (CTE) which is less than CTE of the second conformal dielectric layer, second conductive layer, and third conductive layer.
8. A method of manufacturing a semiconductor device, comprising:
providing a substrate;
forming a first conductive layer over a top surface of the substrate;
forming a first insulating layer over the substrate;
forming a first dielectric layer over the first insulating layer;
forming a second conductive layer over the first conductive layer and first dielectric layer;
forming a second dielectric layer over the second conductive layer;
depositing a polymer material over the second dielectric layer and second conductive layer; and
forming a third conductive layer over the polymer material and second conductive layer, the third conductive layer being electrically connected to the second conductive layer.
9. The method of claim 8 , further including forming a solder bump over the third conductive layer.
10. The method of claim 8 , further including removing a portion of the polymer material over the second conformal dielectric layer.
11. The method of claim 8 , further including forming a conductive via through a back surface of the substrate, opposite the top surface of the substrate, the conductive via being electrically connected to the first conductive layer.
12. The method of claim 11 , wherein the conductive via has vertical or tapered sidewalls.
13. The method of claim 11 , further including forming a solder bump over the conductive via.
14. The method of claim 11 , further including:
forming a fourth conductive layer over the back surface of the substrate and into the conductive via, the fourth conductive layer being electrically connected to the first conductive layer; and
forming a second insulating layer over the fourth conductive layer;
removing a portion of the second insulating layer to expose the fourth conductive layer; and
forming a solder bump over the fourth conductive layer.
15. The method of claim 8 , wherein the polymer material has a coefficient of thermal expansion (CTE) which is less than CTE of the second dielectric layer, second conductive layer, and third conductive layer.
16. A method of manufacturing a semiconductor device, comprising:
providing a substrate;
forming a first conductive layer over a top surface of the substrate;
forming a first insulating layer over the substrate;
forming a second conductive layer over the first conductive layer and first insulating layer;
depositing a polymer material over the second conductive layer;
forming a third conductive layer over the second conductive layer, the third conductive layer being electrically connected to the second conductive layer;
forming a first dielectric layer over the first insulating layer; and
forming a second dielectric layer over the second conductive layer.
17. The method of claim 16 , wherein the polymer material has a coefficient of thermal expansion (CTE) which is less than CTE of the second dielectric layer, second conductive layer, and third conductive layer.
18. The method of claim 16 , further including forming a conductive via through a back surface of the substrate, opposite the top surface of the substrate, the conductive via being electrically connected to the first conductive layer.
19. The method of claim 18 , wherein the conductive via has vertical or tapered sidewalls.
20. A semiconductor device, comprising:
a substrate;
a first conductive layer formed over a top surface of the substrate;
a first insulating layer formed over the substrate;
a first dielectric layer formed over the first insulating layer;
a second conductive layer formed over the first conductive layer and first dielectric layer;
a second dielectric layer formed over the second conductive layer;
a polymer material deposited over the second dielectric layer and second conductive layer; and
a third conductive layer formed over the polymer material and second conductive layer, the third conductive layer being electrically connected to the second conductive layer.
21. The semiconductor device of claim 20 , further including a conductive via formed through a back surface of the substrate, opposite the top surface of the substrate, the conductive via being electrically connected to the first conductive layer.
22. The semiconductor device of claim 21 , wherein the conductive via has vertical or tapered sidewalls.
23. The semiconductor device of claim 21 , further including:
a fourth conductive layer formed over the back surface of the substrate and into the conductive via, the fourth conductive layer being electrically connected to the first conductive layer;
a second insulating layer formed over the fourth conductive layer; and
a second solder bump formed over the fourth conductive layer.
24. The semiconductor device of claim 20 , wherein the polymer material has a coefficient of thermal expansion (CTE) which is less than CTE of the second dielectric layer, second conductive layer, and third conductive layer.