Integrated circuit packaging system with interposer

1. A method of manufacturing an integrated circuit packaging system comprising:

forming an interposer having a coupling slot;

securing an upper die on the interposer;

providing a substrate having an integrated circuit on a component side and system interconnects on a connection side including

mounting the interposer over the integrated circuit; and

coupling the integrated circuit to the upper die through the coupling slot.

2. The method as claimed in claim 1 further comprising:

mounting a second integrated circuit on the substrate; and

electrically connecting the second integrated circuit to the interposer.

3. The method system as claimed in claim 1 further comprising:

securing a second upper die on the interposer;

coupling an integrated passive device to the interposer; and

electrically connecting the upper die, the second upper die, the integrated passive device, or a combination thereof to the integrated circuit.

4. The method as claimed in claim 1 wherein coupling the integrated circuit to the upper die includes bonding an electrical interconnect.

5. A method of manufacturing an integrated circuit packaging system comprising:

forming an interposer having a coupling slot;

forming bond pads around the coupling slot;

securing an upper die on the interposer including electrically connecting the upper die to a bond pad;

providing a substrate having an integrated circuit on a component side and system interconnects on a system side including mounting the interposer over the integrated circuit including positioning the coupling slot over the integrated circuit; and

coupling the integrated circuit to the upper die through the coupling slot including bonding an electrical interconnect through the coupling slot.

6. The method as claimed in claim 5 further comprising:

mounting a second integrated circuit on the substrate adjacent to the integrated circuit; and

electrically connecting the second integrated circuit to the interposer including electrically connecting the integrated circuit to the second integrated circuit through the interposer.

7. The method as claimed in claim 5 further comprising:

securing a second upper die on the interposer including electrically connecting the second upper die to the interposer;

coupling an integrated passive device to the interposer includes electrically connecting the integrated passive device to the upper die, the second upper die, the bond pad, or a combination thereof; and

electrically connecting the upper die, the second upper die, the integrated passive device, or a combination thereof to the integrated circuit includes bonding the electrical interconnect between the bond pad and the integrated circuit.

8. The method as claimed in claim 5 wherein coupling the integrated circuit to the upper die includes connecting the electrical interconnect to the bond pad on the interposer.

9. An integrated circuit packaging system comprising:

an interposer having a coupling slot;

an upper die on the interposer;

a substrate having an integrated circuit on a component side and system interconnects on a system side includes the interposer over an the integrated circuit; and

the integrated circuit coupled to the upper die through the coupling slot.

10. The system as claimed in claim 9 further comprising:

a second integrated circuit on the substrate; and

the second integrated circuit electrically connected to the interposer.

11. The system as claimed in claim 9 further comprising:

a second upper die on the interposer;

an integrated passive device coupled to the interposer; and

the upper die, the second upper die, the integrated passive device, or a combination thereof electrically connected to the integrated circuit.

12. The system as claimed in claim 9 wherein the integrated circuit coupled to the upper die includes an electrical interconnect bonded to the integrated circuit.

13. The system as claimed in claim 9 further comprising:

bond pads formed around the coupling slot;

the upper die electrically connected to a bond pad;

the coupling slot positioned over the integrated circuit; and

an electrical interconnect bonded through the coupling slot.

14. The system as claimed in claim 13 further comprising:

an adhesive between the substrate and the integrated circuit;

a second integrated circuit on the substrate adjacent to the integrated circuit; and

the second integrated circuit electrically connected to the interposer includes the integrated circuit electrically connected to the second integrated circuit through the interposer.

15. The system as claimed in claim 13 further comprising:

a second upper die on the interposer includes the second upper die electrically connected to the interposer;

an integrated passive device coupled to the interposer includes the integrated passive device electrically connected to the upper die, the second upper die, the bond pad, or a combination thereof; and

the upper die, the second upper die, the integrated passive device, or a combination thereof electrically connected to the integrated circuit includes the electrical interconnect bonded between the bond pad and the integrated circuit.

16. The system as claimed in claim 13 wherein the integrated circuit coupled to the upper die includes the electrical interconnect connected to the bond pad on the interposer.

17. The system as claimed in claim 13 wherein:

the substrate includes an enhanced ball grid array substrate having a first signal trace in a first step and a second signal trace in a second step;

the integrated circuit mounted adjacent to the first step;

the interposer mounted over the first step; and

the integrated circuit electrically connected to the first signal trace, the second signal trace, or a combination thereof through the interposer.