Integrated circuit packaging system with package stacking and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed; forming a hole through the encapsulation with the hole not exposing the integrated circuit; forming a through conductor in the hole; and mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed;
forming a hole through the encapsulation with the hole not exposing the integrated circuit;
forming a through conductor in the hole; and
mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.
2. The method as claimed in claim 1 wherein forming the encapsulation surrounding the integrated circuit having the inactive side and the active side exposed includes forming the encapsulation below the inactive side.
3. The method as claimed in claim 1 further comprising:
providing the substrate having a base opening; and
connecting a base device, inside the base opening, with the active side facing the base device.
4. The method as claimed in claim 1 further comprising:
forming a mountable contact over the through conductor or over the inactive side; and
connecting a stack package over the inactive side and over the through conductor.
5. The method as claimed in claim 1 wherein:
forming the through conductor includes forming the through conductor having a protrusion with the protrusion extended beyond the encapsulation; and
further comprising:
connecting a stack package over the inactive side and over the through conductor includes connecting the protrusion to the stack package and the substrate.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming an encapsulation surrounding an integrated circuit having an inactive side and an active side exposed and the encapsulation is coplanar with the active side;
forming a hole through the encapsulation with the hole not exposing the integrated circuit;
forming a through conductor in the hole; and
mounting a substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate and an electrical connector between the active side and the substrate.
7. The method as claimed in claim 6 wherein mounting the substrate with the integrated circuit surrounded by the encapsulation with the active side facing the substrate and the electrical connector between the active side and the substrate includes connecting the electrical connector and the through conductor.
8. The method as claimed in claim 6 wherein forming the encapsulation surrounding the integrated circuit having the inactive side and the active side exposed includes forming the encapsulation coplanar with the active side and the inactive side.
9. The method as claimed in claim 6 further comprising applying an underfill between the substrate and the encapsulation.
10. The method as claimed in claim 6 wherein:
forming the through conductor includes forming the through conductor having a protrusion with the protrusion extended beyond the encapsulation; and
further comprising:
connecting a stack package over the inactive side and over the through conductor includes connecting the protrusion to the stack package and the substrate; and
connecting an interconnect over the inactive side with the interconnect made of the same material as the through conductor.
11. An integrated circuit packaging system comprising:
an integrated circuit having an inactive side and an active side;
an encapsulation surrounding the integrated circuit with the inactive side and the active side exposed, and the encapsulation having a hole not exposing the integrated circuit;
a through conductor in the hole; and
a substrate mounted with the integrated circuit surrounded by the encapsulation with the active side facing the substrate.
12. The system as claimed in claim 11 wherein the encapsulation is below the inactive side.
13. The system as claimed in claim 11 wherein:
the substrate includes the substrate having a base opening; and
further comprising:
a base device, inside the base opening, with the active side facing the base device.
14. The system as claimed in claim 11 further comprising:
a mountable contact over the through conductor or over the inactive side; and
a stack package connected over the mountable contact.
15. The system as claimed in claim 11 wherein:
the through conductor includes a protrusion with the protrusion extended beyond the encapsulation; and
further comprising:
a stack package connected over the inactive side and over the through conductor includes the protrusion connected to the stack package and the substrate.
16. The system as claimed in claim 11 further comprising:
an electrical connector between the active side and the substrate; and
wherein:
the encapsulation is coplanar with the active side.
17. The system as claimed in claim 16 wherein the electrical connector is connected to the through conductor.
18. The system as claimed in claim 16 wherein the encapsulation is coplanar with the active side and the inactive side.
19. The system as claimed in claim 16 further comprising an underfill between the substrate and the encapsulation.
20. The system as claimed in claim 16 wherein:
the through conductor includes a protrusion with the protrusion extended beyond the encapsulation and the protrusion connected to the substrate; and
further comprising:
a stack package connected to the protrusion; and
an interconnect connected over the inactive side with the interconnect made of the same material as the through conductor.