Integrated circuit packaging system with z-interconnects having traces and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a carrier;

mounting an integrated circuit on the carrier;

mounting a z-interconnect on the carrier;

cantilevering a trace over the integrated circuit of the z-interconnect;

attaching the trace to the integrated circuit with a die attach adhesive, a wire-in-film adhesive, or a combination thereof;

encapsulating the integrated circuit with an encapsulation;

removing the carrier;

connecting a substrate below the integrated circuit;

forming an external interconnect mounted below the substrate; and

connecting an external device to the trace.

2. The method as claimed in claim 1 further comprising:

encapsulating the trace in a trace encapsulation leaving a portion of the trace exposed from the trace encapsulation; or

wherein:

encapsulating the integrated circuit with the encapsulation includes partially encapsulating the trace, the z-interconnect, or a combination thereof.

3. The method as claimed in claim 1 further comprising:

cantilevering a trace away from the integrated circuit of the z-interconnect.

4. The method as claimed in claim 1 wherein:

mounting the z-interconnects includes mounting the z-interconnect: along one side of the integrated circuit, surrounding the integrated circuit in a single row, surrounding the integrated circuit in multiple rows, or a combination thereof.

5. A method of manufacture of an integrated circuit packaging system comprising:

providing a carrier;

mounting integrated circuits on the carrier;

mounting a leadframe on the carrier, the leadframe having a z-interconnect;

cantilevering a trace over the integrated circuits of the z-interconnect;

attaching the trace to the integrated circuits with a die attach adhesive, a wire-in-film adhesive, or a combination thereof;

encapsulating the integrated circuits and at least a portion of the leadframe with an encapsulation;

removing the carrier;

connecting a substrate below the integrated circuits;

singulating the encapsulation to remove the leadframe;

forming an external interconnect mounted below the substrate; and

connecting an external device to the trace.

6. The method as claimed in claim 5 wherein

connecting the external device includes connecting the external device to the trace with a solder ball, a bond wire, or a combination thereof.

7. The method as claimed in claim 5 further comprising:

mounting an external device above the substrate; and wherein:

mounting the external device includes mounting a flip chip, a wire-bonded package, a wafer level chip scale package, or passive components.

8. The method as claimed in claim 5 wherein:

encapsulating at least a portion of the leadframe includes retaining an exposed upper surface not covered by the encapsulation.

9. An integrated circuit packaging system comprising:

a substrate;

an integrated circuit mounted on the substrate;

an external interconnected mounted below the substrate;

a z-interconnect mounted on the substrate, the z-interconnect for supporting a trace cantilevered over the integrated circuit;

a trace cantilevered over the integrated circuit of the z-interconnect;

a die attach adhesive, a wire-in-film adhesive, or a combination thereof attaching the trace to the integrated circuit;

an encapsulation encapsulating the integrated circuit; and

an external device connected to the trace.

10. The system as claimed in claim 9 further comprising:

a trace encapsulation encapsulating the trace leaving a portion of the trace exposed from the trace encapsulation; or

wherein:

the encapsulation includes partially encapsulating the trace, the z-interconnect, or a combination thereof.

11. The system as claimed in claim 9 further comprising:

a second trace cantilevered away from the integrated circuit.

12. The system as claimed in claim 9 further comprising:

underfill filling between the encapsulation and the external device.

13. The system as claimed in claim 9 wherein:

the z-interconnect is mounted: along one side of the integrated circuit in a single row surrounding the integrated circuit, in multiple rows surrounding the integrated circuit, or a combination thereof.

14. The system as claimed in claim 9 further comprising:

a solder ball, a bond wire, or a combination thereof connecting the external device to the trace.

15. The system as claimed in claim 9 wherein:

the external device is a flip chip, a wire-bonded package, a wafer level chip scale package, or passive components.

16. The system as claimed in claim 9 wherein:

the substrate has an exposed upper surface not covered by the encapsulation.