Integrated circuit packaging system with leads and transposer and method of manufacture thereof

1. An integrated circuit packaging system comprising:

a transposer;

an adhesive pad attached to the transposer, the adhesive pad in a form of a continuous ring;

a lead having an inner end wire bonded to a first surface of the transposer, the inner end attached to the adhesive pad;

a die conductively bonded to the first surface of the transposer, the die and the adhesive pad attached to the first surface; and

a mold compound encapsulating the inner end, the mold compound having a bottom mold surface exposed and coplanar with a surface of the transposer opposite the first surface.

2. The system as claimed in claim 1 wherein the mold compound has the bottom mold surface coplanar with an outer end of the lead.

3. The system as claimed in claim 1 wherein the transposer has a terminal pad on the surface opposite the first surface.

4. The system as claimed in claim 1 further comprising:

a die pad attached to the die and also attached to the first surface of the transposer.

5. The system as claimed in claim 1 further comprising:

a multiplicity of die pads attached to the first surface of the transposer.

6. The system as claimed in claim 1 further comprising:

a tiebar connected to the transposer.

7. The system as claimed in claim 6 further comprising:

a rivet riveting a tiebar contact pad of the tiebar to the transposer.

8. The system as claimed in claim 6 further comprising:

a passive device attached to the first surface of the transposer.

9. The system as claimed in claim 6 wherein the transposer is a substrate transposer having a ring shape and surrounding the die.

10. The system as claimed in claim 6 wherein the transposer is a substrate transposer having a recessed center portion and a die pad is attached to the recessed center portion.