Method of a package on package packaging
View Patent ↗A method of manufacture of an integrated circuit package-on-package system includes providing a base package and providing solder caps on the top of the base package configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package, and configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package.
1. A package-on-package packaging method, comprising:
providing a base package; and
providing solder caps on the top of the base package:
configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package;
configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package; and
forming a solder mask dam on the top of the base package to protect from the resin bleed.
2. The method as claimed in claim 1 wherein providing the solder caps further comprises solder paste printing, electroplating, electroless plating, or solder ball attaching.
3. The method as claimed in claim 1 wherein providing the solder caps further comprises forming the solder caps in the same step as the formation of a solder-on-pad finish on a flip chip site on the base package.
4. The method as claimed in claim 1 further comprising:
providing a top package having solder balls on the bottom thereof; and
assembling the top package onto the base package by merging the solder balls with the solder caps.
5. A package-on-package packaging method, comprising:
providing a base package having landing pads on the top thereof;
providing solder caps on the landing pads on the top of the base package:
configured to protrude above subsequent resin bleed, the resin bleed extending to an edge of the base package, to protect from resin bleed obstruction; and
configured for merging with solder balls of a top package to form larger solder balls between such a top package and the base package;
forming a solder mask dam on the top of the base package to limit the resin bleed; and
attaching a semiconductor device onto the top of the base package, the solder mask dam around the semiconductor device.
6. The method as claimed in claim 5 wherein providing the solder caps further comprises solder paste printing, electroplating, electroless plating, or solder ball attaching.
7. The method as claimed in claim 5 wherein providing the solder caps further comprises forming the solder caps in the same step as the formation of a solder-on-pad finish on a flip chip site on the top of the base package.
8. The method as claimed in claim 5 further comprising:
providing a top package having solder balls on the bottom thereof for connection to and mounting onto the base package; and
assembling the top package onto the base package by merging the solder balls with the solder caps to form larger solder balls between the top package and the base package.