Integrated circuit packaging system with etched ring and die paddle and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system is provided including: forming a D-ring includes half etching a paddle, etching a ring, and etching a tie bar. The tie bar is between the paddle and the ring. The system further includes mounting an integrated circuit die on a central portion of the D-ring, connecting the integrated circuit die and the D-ring, and encapsulating the integrated circuit die and a portion of the D-ring.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a D-ring comprises:
half etching a paddle,
etching a ring, and
etching a tie bar, the tie bar is between the paddle and the ring;
mounting an integrated circuit die on a central portion of the D-ring with the integrated circuit die extending horizontally beyond the paddle;
connecting the integrated circuit die and the D-ring; and
encapsulating the integrated circuit die and a portion of the D-ring.
2. The method as claimed in claim 1 wherein mounting the integrated circuit die on the central portion of the D-ring includes mounting the integrated circuit die on the paddle and the tie bar.
3. The method as claimed in claim 1 wherein encapsulating the portion of the D-ring includes encapsulating the ring and a portion of the paddle.
4. The method as claimed in claim 1 wherein forming the D-ring includes forming a side bar, a corner bar, or both between the ring and the paddle.
5. The method as claimed in claim 1 further comprising:
half etching an external interconnect; and
connecting the integrated circuit die and the external interconnect.
6. An integrated circuit package system comprising:
a D-ring comprises:
a paddle,
a ring, and
a tie bar between the paddle and the ring;
an integrated circuit die on a central portion of the D-ring with the integrated circuit die extending horizontally beyond the paddle;
an interconnect between the integrated circuit die and the D-ring; and
an encapsulation to cover the integrated circuit die and a portion of the D-ring.
7. The system as claimed in claim 6 wherein the integrated circuit die on the central portion of the D-ring includes the integrated circuit die on the paddle and the tie bar.
8. The system as claimed in claim 6 wherein the encapsulation to cover the portion of the D-ring includes the encapsulation to cover the ring and a portion of the paddle.
9. The system as claimed in claim 6 wherein the D-ring includes a side bar, a corner bar, or both between the ring and the paddle.
10. The system as claimed in claim 6 further comprising an external interconnect electrically connected to the integrated circuit die with the interconnect.
11. The system as claimed in claim 6 wherein:
the D-ring comprises:
the paddle in a central portion,
the ring at a boundary, and
the tie bar between the paddle and the ring;
the integrated circuit die on the D-ring is on the paddle and the tie bar;
the interconnect between the integrated circuit die and the D-ring is connected to the ring;
the encapsulation is a cover for the integrated circuit die, the interconnect, the ring, and a portion of the paddle; and
further comprising:
an external interconnect connected to the integrated circuit die by the interconnect.
12. The system as claimed in claim 11 the integrated circuit die on the paddle and the tie bar includes the integrated circuit die attached with an adhesive.
13. The system as claimed in claim 11 further comprising a plating on the ring.
14. The system as claimed in claim 11 wherein the external interconnect has an inner portion etched.
15. The system as claimed in claim 11 further comprising a slot between the ring and the paddle to eliminate resin bleed on the ring from an adhesive.