Integrated circuit packaging system with interposer and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate; mounting a pre-formed interposer, having an interposer through via and an integrated passive device, over the lower integrated circuit with the interposer through via coupled to the first through via; attaching an upper integrated circuit, having a second through via, over the pre-formed interposer; and forming an encapsulation over the upper integrated circuit and the pre-formed interposer.
1. A method of manufacture of an integrated circuit packaging system comprising:
attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate;
mounting a pre-formed interposer, having an interposer through via and an integrated passive device, over the lower integrated circuit with the interposer through via coupled to the first through via;
connecting a first electrical interconnect between different types of integrated passive devices to form filtering circuits to form filtering circuits, attaching an upper integrated circuit, having a second through via, over the pre- formed interposer; and
forming an encapsulation over the upper integrated circuit and the pre-formed interposer.
2. The method as claimed in claim 1 further comprising connecting a first electrical interconnect between the integrated passive device and the interposer through via.
3. The method as claimed in claim 1 wherein mounting the pre- formed interposer over the lower integrated circuit includes mounting an embedded integrated circuit over the lower integrated circuit with the embedded integrated circuit within the pre-formed interposer.
4. The method as claimed in claim 1 further comprising connecting a second electrical interconnect between different portions of the substrate.
5. A method of manufacture of an integrated circuit packaging system comprising:
attaching a lower integrated circuit, having a first through via, over a substrate with the first through via coupled to the substrate;
mounting a pre-formed interposer, having an interposer through via, an integrated passive device, and a first electrical interconnect, over the lower integrated circuit with the interposer through via coupled to the first through via and the first electrical interconnect connected to the integrated passive device;
attaching an upper integrated circuit, having a second through via, over the pre- formed interposer, includes attaching a flip chip;
forming an encapsulation over the upper integrated circuit and the pre-formed interposer; and
attaching an external interconnect under the substrate.
6. The method as claimed in claim 5 wherein attaching the upper integrated circuit, having the second through via, over the pre-formed interposer includes connecting the second through via and the interposer through via.
7. The method as claimed in claim 5 wherein mounting the pre- formed interposer over the lower integrated circuit includes:
mounting a silicon interposer.
8. The method as claimed in claim 5 wherein:
mounting the pre-formed interposer over the lower integrated circuit includes:
mounting an embedded integrated circuit over the lower integrated circuit with the embedded integrated circuit within the pre-formed interposer; and
attaching the upper integrated circuit, having the second through via, over the pre- formed interposer includes:
mounting the upper integrated circuit over the embedded integrated circuit.
9. An integrated circuit packaging system comprising:
a substrate;
a lower integrated circuit, having a first through via, over the substrate with the first through via coupled to the substrate;
a pre-formed interposer, having an interposer through via and an integrated passive device, over the lower integrated circuit with the interposer through via coupled to the first through via;
an upper integrated circuit, having a second through via, over the pre-formed interposer; and
an encapsulation over the upper integrated circuit and the pre-formed interposer.
10. The system as claimed in claim 9 further comprising a first electrical interconnect between the integrated passive device and the interposer through via.
11. The system as claimed in claim 9 wherein the pre-formed interposer includes an embedded integrated circuit over the lower integrated circuit.
12. The system as claimed in claim 9 further comprising a first electrical interconnect between different types of the integrated passive devices to form filtering circuits.
13. The system as claimed in claim 9 further comprising a second electrical interconnect between different portions of the substrate.
14. The system as claimed in claim 9 wherein:
the pre-formed interposer includes a first electrical interconnect connected to the integrated passive device; and
further comprising:
an external interconnect under the substrate.
15. The system as claimed in claim 14 wherein the upper integrated circuit having the second through via includes the second through via connected to the interposer through via.
16. The system as claimed in claim 14 wherein the pre-formed interposer includes a silicon interposer.
17. The system as claimed in claim 14 wherein:
the pre-formed interposer includes:
an embedded integrated circuit over the lower integrated circuit; and
the upper integrated circuit, having the second through via, over the pre-formed interposer includes:
the upper integrated circuit over the embedded integrated circuit.
18. The system as claimed in claim 14 wherein the upper integrated circuit includes a flip chip.