Integrated circuit packaging system with stacked device and method of manufacturing thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion; forming a second lead having a second body and a second tip adjacent to the paddle; attaching a device, having a device active side, to the paddle and adjacent to the protrusion; mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip; connecting the component and the second body; and forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion;
forming a second lead having a second body and a second tip adjacent to the paddle;
attaching a device, having a device active side, to the paddle and adjacent to the protrusion;
mounting a component, having a component active side, to the device with the component active side facing the device active side and between the second body and the first tip;
connecting the component and the second body; and
forming an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.
2. The method as claimed in claim 1 wherein forming the first lead, having the first body and the first tip, and the paddle, having the protrusion at the side of the paddle, with the first body adjacent to the protrusion includes forming the protrusion facing the first body and facing away from the second tip.
3. The method as claimed in claim 1 wherein mounting the component includes mounting the component over the first body.
4. The method as claimed in claim 1 further comprising attaching a first internal interconnect between the device and the component.
5. The method as claimed in claim 1 wherein forming the first lead, having the first body and the first tip, and the paddle includes forming the paddle coplanar with the first body.
6. A method of manufacture of an integrated circuit packaging system comprising:
forming a first lead, having a first body and a first tip, and a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion;
forming a second lead having a second body and a second tip adjacent to the paddle;
attaching a device, having a device active side, to the paddle and adjacent to the protrusion;
mounting a component, having a component active side, to the device and over the first body with the component active side facing the device active side and the component between the second body and the first tip;
connecting the component and the second body; and
forming an encapsulation covering the device, and partially covering the paddle with the protrusion covered, the component, the first lead, and the second lead.
7. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation coplanar with the paddle, the first body, and the second tip.
8. The method as claimed in claim 6 wherein forming the encapsulation includes forming the encapsulation coplanar with the component, the first tip, and the second body.
9. The method as claimed in claim 6 wherein:
mounting the component, having the component active side, to the device with the component active side facing the device active side includes attaching a first internal interconnect between the device and the component; and
connecting the component and the second body includes attaching a second internal interconnect to the component and the second lead.
10. The method as claimed in claim 6 wherein mounting the component includes mounting a flip chip.
11. An integrated circuit packaging system comprising:
a first lead having a first body and a first tip;
a paddle, having a protrusion at a side of the paddle, with the first body adjacent to the protrusion;
a second lead having a second body and a second tip adjacent to the paddle;
a device, having a device active side, to the paddle and adjacent to the protrusion;
a component, having a component active side, mounted to the device with the component active side facing the device active side, between the second body and the first tip, and connected to the second body; and
an encapsulation covering the device, and partially covering the paddle, the component, the first lead, and the second lead.
12. The system as claimed in claim 11 wherein the paddle includes the protrusion facing the first body and facing away from the second tip.
13. The system as claimed in claim 11 wherein the component is over the first body.
14. The system as claimed in claim 11 further comprising a first internal interconnect between the device and the component.
15. The system as claimed in claim 11 wherein the paddle is coplanar with the first body.
16. The system as claimed in claim 11 wherein:
the component is over the first body; and
the encapsulation covers the protrusion.
17. The system as claimed in claim 16 wherein the encapsulation is coplanar with the paddle, the first body, and the second tip.
18. The system as claimed in claim 16 wherein the encapsulation is coplanar with the component, the first tip, and the second body.
19. The system as claimed in claim 16 further comprising:
a first internal interconnect between the device and the component; and
a second internal interconnect to the component and the second lead.
20. The system as claimed in claim 16 wherein the component includes a flip chip.