Integrated circuit package system with die and package combination

1. An integrated package system with die and package combination comprising:

forming a leadframe having internal leads and external leads;

encapsulating a first integrated circuit on the leadframe;

encapsulating a second integrated circuit over the encapsulated first integrated circuit; and

wherein encapsulating the second integrated circuit further comprises encapsulating a package having the first integrated circuit.

2. The system as claimed in claim 1 wherein forming the leadframe further comprises forming the internal leads having a different pitch than that of the external leads.

3. The system as claimed in claim 1 wherein forming the leadframe further comprises forming a die pad and tie bars.

4. An integrated package system with die and package combination comprising:

forming a leadframe having internal leads and external leads;

mounting a first integrated circuit on the leadframe;

connecting first electrical interconnects between the first integrated circuit and the internal leads;

molding a first encapsulant over the first integrated circuit;

mounting a second integrated circuit over the encapsulated first integrated circuit;

connecting second electrical interconnects between the second integrated circuit and the external leads;

molding a second encapsulant encapsulating the second integrated circuit; and

wherein molding the second encapsulant over the second integrated circuit includes molding the second encapsulant over a package having the first integrated circuit.

5. The system as claimed in claim 4 wherein forming the leadframe further comprises forming the internal leads connected to the external leads.

6. The system as claimed in claim 4 wherein forming the leadframe further comprises forming a power-ground ring interconnecting the external leads.

7. The system as claimed in claim 4 wherein forming the leadframe further comprises forming a matrix of the integrated circuit package system with die and package combination.

8. The system as claimed in claim 4 wherein mounting the second integrated circuit further comprises mounting the second integrated circuit on a mold cap formed by the first encapsulant and excluding internal dam bars.

9. An integrated package system with die and package combination comprising:

a leadframe having internal leads and external leads;

a first integrated circuit encapsulated by a first encapsulant on the leadframe; and

a second integrated circuit encapsulated with the first encapsulant by a second encapsulant.

10. The system as claimed in claim 9 wherein the leadframe further comprises the internal leads having a different pitch than that of the external leads.

11. The system as claimed in claim 9 wherein the leadframe further comprises a die pad and tie bars.

12. The system as claimed in claim 9 wherein the second encapsulant further comprises a package having the first integrated circuit.

13. The system as claimed in claim 9 further comprising:

first electrical interconnects between the first integrated circuit and the internal leads of the leadframe; and

second electrical interconnects between the second integrated circuit and the external leads of the leadframe.

14. The system as claimed in claim 13 wherein the leadframe further comprises the internal leads connected to the external leads.

15. The system as claimed in claim 13 wherein the leadframe further comprises a power-ground ring interconnecting the external leads.

16. The system as claimed in claim 13 wherein the leadframe further comprises a matrix of the integrated circuit package system with die and package combination.

17. The system as claimed in claim 13 wherein the second integrated circuit further comprises the second integrated circuit on a mold cap formed by a first encapsulant without internal dam bars.