Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a base lead having an outer protrusion and an inner protrusion with a recess in between; forming a stack lead having an elongated portion; mounting a base integrated circuit over the inner protrusion or under the elongated portion; mounting the stack lead over the base lead and the base integrated circuit; connecting a stack integrated circuit and the stack lead with the stack integrated circuit over the base integrated circuit; and encapsulating at least a portion of both the base integrated circuit and the stack integrated circuit with the base lead and the stack lead exposed.
1. An integrated circuit packaging system comprising:
a base lead having an outer protrusion and an inner protrusion with a recess in between;
a flip-chip, having a base non-active side, coupled to and facing the inner protrusion;
a stack lead, having an overhang portion and an elongated portion, over the outer protrusion and the base non-active side with the flip-chip over the inner protrusion or under the elongated portion;
a stack integrated circuit connected to the elongated portion with the stack integrated circuit over the flip-chip; and
an encapsulation covering at least a portion of both the flip-chip and the stack integrated circuit with the base lead and the overhang portion exposed.
2. The system as claimed in claim 1 wherein the stack lead over the base lead and the flip-chip includes:
the stack lead connected to the outer protrusion; and
the elongated portion over a base non-active side of the flip-chip.
3. The system as claimed in claim 1 wherein the stack integrated circuit connected to the stack lead includes the stack integrated circuit connected to the elongated portion.
4. The system as claimed in claim 1 wherein the flip-chip over the inner protrusion includes the flip-chip connected to the inner protrusion with the flip-chip facing the inner protrusion.
5. The system as claimed in claim 1 wherein the stack integrated circuit connected to the stack lead with the stack integrated circuit over the flip-chip includes the stack integrated circuit connected to the flip-chip.
6. The system as claimed in claim 1 wherein the encapsulation includes:
the encapsulation having a recess exposing the flip-chip, the stack integrated circuit, or a combination thereof; and
further comprising:
an external component in the recess.
7. The system as claimed in claim 1 further comprising a further base lead over the stack lead, the further base lead identical to the base lead.
8. The system as claimed in claim 1 further comprising a lead interconnect between the base lead and the stack lead.