Semiconductor package and method of mounting semiconductor die to opposite sides of TSV substrate
View Patent ↗A semiconductor package has a first conductive via formed through a substrate. The substrate with first conductive via is mounted to a first carrier. A first semiconductor die is mounted to a first surface of the substrate. A first encapsulant is deposited over the first die and first carrier. The first carrier is removed. The first die and substrate with the first encapsulant is mounted to a second carrier. A second semiconductor die is mounted to a second surface of the substrate opposite the first surface of the substrate. A second encapsulant is deposited over the second die. The second carrier is removed. A bump is formed over the second surface of the substrate. A conductive layer can be mounted over the first die. A second conductive via can be formed through the first encapsulant and electrically connected to the first conductive via. The semiconductor packages are stackable.
1. A method of making a semiconductor package, comprising:
providing a wafer level substrate;
forming a plurality of vias through the wafer level substrate;
depositing conductive material in the vias to form first conductive vias through the wafer level substrate;
providing a first carrier;
mounting the wafer level substrate with first conductive vias to the first carrier;
mounting a first semiconductor die to a first surface of the wafer level substrate;
depositing a first encapsulant over the first semiconductor die and first carrier;
removing the first carrier;
providing a second carrier;
mounting the first semiconductor die and wafer level substrate with the first encapsulant to the second carrier;
mounting a second semiconductor die to a second surface of the wafer level substrate opposite the first surface of the wafer level substrate;
depositing a second encapsulant over the second semiconductor die; and
removing the second carrier.
2. The method of claim 1 , further including forming a plurality of bumps over the second surface of the wafer level substrate.
3. The method of claim 1 , further including mounting a conductive layer over the first semiconductor die.
4. The method of claim 1 , further including forming a plurality of second conductive vias through the first encapsulant, the second conductive vias being electrically connected to the first conductive vias.
5. The method of claim 1 , further including forming a plurality of bumps over the first conductive vias prior to depositing the first encapsulant.
6. The method of claim 1 , further including stacking a plurality of semiconductor packages each containing the first and second semiconductor die mounted to the first and second surfaces of the wafer level substrate.
7. The method of claim 1 , further including stacking a plurality of semiconductor packages each containing the first semiconductor die mounted to the first surface of the wafer level substrate.
8. A method of making a semiconductor package, comprising:
providing a substrate;
forming a first conductive via through the substrate;
mounting the substrate with first conductive via to a first carrier;
mounting a first semiconductor die to a first surface of the substrate;
depositing a first encapsulant over the first semiconductor die and first carrier;
removing the first carrier;
mounting the first semiconductor die and substrate with the first encapsulant to a second carrier;
mounting a second semiconductor die to a second surface of the substrate opposite the first surface of the substrate;
depositing a second encapsulant over the second semiconductor die; and
removing the second carrier.
9. The method of claim 8 , further including forming a bump over the second surface of the substrate.
10. The method of claim 8 , further including mounting a conductive layer over the first semiconductor die.
11. The method of claim 8 , further including forming a second conductive via through the first encapsulant, the second conductive via being electrically connected to the first conductive via.
12. The method of claim 8 , further including forming a bump over the first conductive via prior to depositing the first encapsulant.
13. The method of claim 8 , further including stacking a plurality of semiconductor packages each containing the first and second semiconductor die mounted to the first and second surfaces of the substrate.