Integrated circuit packaging system with interconnect and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a planar support structure having a cavity; forming a terminal within the cavity with the terminal coplanar with the planar support structure; forming a conductive pathway on the terminal and the planar support structure with the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion; connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and forming an encapsulation over the planar support structure covering the conductive pathway and the device.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a planar support structure having a cavity;
forming a terminal within the cavity with the terminal having a bottom side coplanar with a bottom side of the planar support structure;
forming a conductive pathway, on the planar support structure, anchored over and connected to the terminal locking the terminal in the cavity, the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion;
connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and
forming an encapsulation over the planar support structure covering the conductive pathway and the device leaving the bottom side of the planar support structure and the terminal exposed for connecting to an external system.
2. The method as claimed in claim 1 wherein:
forming the conductive pathway includes forming the route portion having a route width; and
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion with the connect portion having an attach width greater than the route width.
3. The method as claimed in claim 1 wherein:
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion; and
further comprising:
attaching a further device-pathway interconnect, having a further connect portion, to the device and another of the conductive pathway with the further connect portion inline with the connect portion.
4. The method as claimed in claim 1 further comprising connecting a further terminal and the device with the further terminal not attached to the conductive pathway.
5. The method as claimed in claim 1 wherein:
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion; and
further comprising:
attaching a further device-pathway interconnect, having a further connect portion, to the device and another of the conductive pathway with the further connect portion a spacing from the connect portion and the spacing substantially the same as the connections to the device.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a planar support structure having a cavity;
forming a terminal within the cavity with the terminal having a bottom side coplanar with a bottom side of the planar support structure;
forming a paddle adjacent the terminal;
forming a conductive pathway, on the planar support structure, anchored over and connected to the terminal locking the terminal in the cavity, the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion;
connecting a device and the interconnect attach portion with the interconnect attach portion towards the device; and
forming an encapsulation over the planar support structure covering the conductive pathway and the device leaving the bottom side of the planar support structure and terminal exposed for connecting to an external system.
7. The method as claimed in claim 6 wherein:
forming the conductive pathway includes forming a plated trace having a route width; and
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion with the connect portion having an attach width greater than the route width.
8. The method as claimed in claim 6 wherein:
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion; and
further comprising:
attaching a further device-pathway interconnect, having a further connect portion, to the device and another of the conductive pathway with the further connect portion inline with the connect portion and inside at least one row of the terminal.
9. The method as claimed in claim 6 further comprising connecting a further terminal and the device with the further terminal not attached to the conductive pathway and between the device and the terminal.
10. The method as claimed in claim 6 wherein:
connecting the device and the interconnect attach portion includes attaching a device-pathway interconnect, having a connect portion, to the device and the interconnect attach portion; and
further comprising:
attaching a further device-pathway interconnect, having a further connect portion, to the device and another of the conductive pathway with the device-pathway interconnect substantially parallel to the further device-pathway interconnect.
11. An integrated circuit packaging system comprising:
a planar support structure having a cavity;
a terminal within the cavity and having a bottom side coplanar with a bottom side of the planar support structure;
a conductive pathway, on the planar support structure, anchored over and connected to the terminal locking the terminal in the cavity, the conductive pathway having a route portion and an interconnect attach portion at the end of the route portion;
a device connected to the interconnect attach portion with the interconnect attach portion towards the device; and
an encapsulation over the planar support structure covering the conductive pathway and the device leaving the bottom side of the planar support structure and the terminal exposed for connecting to an external system.
12. The system as claimed in claim 11 wherein:
the conductive pathway includes the route portion having a route width; and
further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion with the connect portion having an attach width greater than the route width.
13. The system as claimed in claim 11 further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion; and
a further device-pathway interconnect, having a further connect portion, attached to the device and another of the conductive pathway with the further connect portion inline with the connect portion.
14. The system as claimed in claim 11 further comprising a further terminal connected to the device with the further terminal not attached to the conductive pathway.
15. The system as claimed in claim 11 further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion; and
a further device-pathway interconnect, having a further connect portion, attached to the device and another of the conductive pathway with the further connect portion a spacing from the connect portion and the spacing substantially the same as the connections to the device.
16. The system as claimed in claim 11 further comprising a paddle adjacent the terminal.
17. The system as claimed in claim 16 wherein:
the conductive pathway includes a plated trace having a route width; and
further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion with the connect portion having an attach width greater than the route width.
18. The system as claimed in claim 16 further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion; and
a further device-pathway interconnect, having a further connect portion, attached to the device and another of the conductive pathway with the further connect portion inline with the connect portion and inside at least one row of the terminal.
19. The system as claimed in claim 16 further comprising a further terminal connected to the device with the further terminal not attached to the conductive pathway and between the device and the terminal.
20. The system as claimed in claim 16 further comprising:
a device-pathway interconnect, having a connect portion, attached to the device and the interconnect attach portion with the connect portion having a spacing substantially the same as the pad pitch; and
a further device-pathway interconnect, having a further connect portion, attached to the device and another of the conductive pathway with the device-pathway interconnect substantially parallel to the further device-pathway interconnect.