Integrated circuit packaging system with package stacking and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

fabricating a base package substrate having a component pad and a stacking pad;

coupling a base integrated circuit die to the component pad;

forming a penetrable encapsulation material for enclosing the base integrated circuit die and the component pad on the base package substrate;

applying an insulation layer directly contacting the penetrable encapsulation material;

attaching a stiffener or a stacked package substrate directly contacting the insulation layer; and

coupling stacked interconnects on the stacking pads adjacent to and not contacting the penetrable encapsulation material.

2. The method as claimed in claim 1 wherein attaching the stiffener includes mounting the stiffener over the penetrable encapsulation material.

3. The method as claimed in claim 1 wherein attaching the stacked package substrate includes coupling a stacked package having the stacked package substrate on the stacked interconnects.

4. The method as claimed in claim 1 further comprising coupling a system pad to the component pad, the stacking pad, or a combination thereof.

5. The method as claimed in claim 1 wherein fabricating the base package substrate includes providing the base package substrate having a central cavity for mounting the base integrated circuit die in the central cavity.

6. A method of manufacture of an integrated circuit packaging system comprising:

fabricating a base package substrate having a component pad and a stacking pad on a component side;

coupling a base integrated circuit die to the component pad includes coupling chip interconnects between the component pad and an integrated circuit pad on the base integrated circuit die;

forming a penetrable encapsulation material for enclosing the base integrated circuit die and the component pad on the base package substrate includes positioning by a die attach device the penetrable encapsulation material;

applying an insulation layer directly contacting the penetrable encapsulation material;

attaching a stiffener or a stacked package substrate directly contacting the insulation layer; and

coupling stacked interconnects on the stacking pad adjacent to and not contacting the penetrable encapsulation material includes coupling a solder ball, a solder, column, a stud bump, or a combination thereof.

7. The method as claimed in claim 6 wherein attaching the stiffener includes mounting the stiffener over the insulation layer and the penetrable encapsulation material, the insulation layer between the stiffener and the penetrable encapsulation material.

8. The method as claimed in claim 6 wherein attaching the stacked package substrate includes coupling a stacked package having the stacked package substrate on the stacked interconnects includes coupling a first stacked integrated circuit to the base integrated circuit die through the stacked interconnects.

9. The method as claimed in claim 6 further comprising coupling a system pad to the component pad, the stacking pad, or a combination thereof includes fabricating internal circuitry between the system pad, the component pad, the stacking pad, or a combination thereof.

10. The method as claimed in claim 6 wherein fabricating the base package substrate includes providing the base package substrate having a central cavity for mounting the base integrated circuit die in the central cavity includes applying an insulator under the base integrated circuit die.

11. An integrated circuit packaging system comprising:

a base package substrate having a component pad and a stacking pad;

a base integrated circuit die coupled to the component pad;

a penetrable encapsulation material to completely enclose the base integrated circuit die and the component pad on the base package substrate;

an insulation layer directly attached to the penetrable encapsulation material;

a stiffener or a stacked package substrate directly attached to the insulation layer over the penetrable encapsulation material; and

stacked interconnects on the stacking pad adjacent to and not contacting the penetrable encapsulation material.

12. The system as claimed in claim 11 wherein the stiffener is mounted over the penetrable encapsulation material.

13. The system as claimed in claim 11 further comprising a stacked package having the stacked package substrate coupled on the stacked interconnects.

14. The system as claimed in claim 11 further comprising a system pad coupled to the component pad, the stacking pad, or a combination thereof.

15. The system as claimed in claim 11 wherein the base package substrate includes the base package substrate having a central cavity for mounting the base integrated circuit die in the central cavity.

16. The system as claimed in claim 11 further comprising:

a component side on the base package substrate;

chip interconnects between the component pad and an integrated circuit pad on the base integrated circuit die; and

a solder ball, a solder column, a stud bump, or a combination thereof on the stacking pad.

17. The system as claimed in claim 16 wherein the stiffener is over the insulation layer and the penetrable encapsulation material, the insulation layer between the stiffener and the penetrable encapsulation material.

18. The system as claimed in claim 16 further comprising a stacked package having the stacked package substrate on the stacked interconnects and a first stacked integrated circuit coupled to the base integrated circuit die through the stacked interconnects.

19. The system as claimed in claim 16 further comprising a system pad coupled to the component pad, the stacking pad, or a combination thereof includes internal circuitry between the system pad, the component pad, the stacking pad, or a combination thereof.

20. The system as claimed in claim 16 wherein the base package substrate includes the base package substrate with a central cavity and the base integrated circuit die mounted in the central cavity includes an insulator under the base integrated circuit die.