Integrated circuit package system with encapsulation lock and method of manufacture thereof
A method of manufacture of an integrated circuit package system includes forming a paddle having a paddle top surface, the paddle top surface having a depression provided therein, forming an external interconnect having a lead tip and a lead body with the lead body having a first recess segment along a length-wise dimension of the lead body, connecting a device over the paddle top surface and the external interconnect, and filling a substantially electrically nonconductive material in the depression.
1. A method of manufacture of an integrated circuit package system comprising:
forming a paddle having a paddle top surface, the paddle top surface having a depression provided therein;
forming an external interconnect having a lead tip and a lead body with the lead body having a first recess segment along a length-wise dimension of the lead body and the first recess segment substantially bisects a second recess segment;
connecting a device over the paddle top surface and the external interconnect; and
filling a substantially electrically nonconductive material in the depression, the first recess segment and the second recess segment.
2. The method as claimed in claim 1 wherein:
forming the external interconnect includes forming the lead body having the second recess segment in a lead body top surface with the second recess segment perpendicular to the first recess segment; and
filling the substantially electrically nonconductive material in the depression includes molding an encapsulation in the first recess segment and in the second recess segment.
3. The method as claimed in claim 1 wherein filling the substantially electrically nonconductive material in the depression includes molding an encapsulation in the first recess segment and in the depression.
4. The method as claimed in claim 1 further comprising:
forming a tie bar having a slot with the tie bar connected to the paddle; and
wherein filling the substantially electrically nonconductive material in the depression includes molding an encapsulation through the slot and in the first recess segment.
5. The method as claimed in claim 1 wherein filling the substantially electrically nonconductive material in the depression includes filling an adhesive in the depression.
6. A method of manufacture of an integrated circuit package system comprising:
forming a paddle, having a depression in a paddle top surface, with a tie bar;
forming an external interconnect having a lead tip and a lead body with a lead tip bottom surface above a lead body bottom surface and with the lead body having a first recess segment, in a lead body top surface, along a length-wise dimension of the lead body and the first recess segment substantially bisects a second recess segment;
connecting an integrated circuit die over the paddle top surface and the external interconnect; and
filling a substantially electrically nonconductive material in the depression, the first recess segment and the second recess segment.
7. The method as claimed in claim 6 wherein connecting the integrated circuit die and the external interconnect includes attaching a solder bump between the integrated circuit die and the lead tip.
8. The method as claimed in claim 6 wherein connecting the integrated circuit die and the external interconnect includes attaching a bond wire between the integrated circuit die and the lead tip.
9. The method as claimed in claim 6 wherein:
forming the paddle with the tie bar includes forming the tie bar having a slot;
forming the external interconnect includes forming the lead tip having a hole; and
filling the substantially electrically nonconductive material in the depression includes molding an encapsulation through the slot and the hole.
10. The method as claimed in claim 6 wherein:
forming the external interconnect includes:
forming the lead body having the second recess segment in the lead body top surface with the second recess segment perpendicular to the first recess segment, and
forming the lead tip having a hole;
forming the paddle with the tie bar includes forming the tie bar having a slot; and
filling the substantially electrically nonconductive material in the depression includes molding an encapsulation through the slot, through the hole, and in the first recess segment.
11. An integrated circuit package system comprising:
a paddle having a paddle top surface, the paddle top surface having a depression provided therein;
an external interconnect having a lead tip and a lead body with the lead body having a first recess segment along a length-wise dimension of the lead body and the first recess segment substantially bisects a second recess segment;
a device over the paddle top surface;
an internal interconnect between the device and the external interconnect; and
a substantially electrically nonconductive material in the depression, the first recess segment and the second recess segment.
12. The system as claimed in claim 11 wherein:
the external interconnect includes the lead body having the second recess segment in the lead body top surface with the second recess segment perpendicular to the first recess segment; and
the substantially electrically nonconductive material includes an encapsulation in the first recess segment and in the second recess segment.
13. The system as claimed in claim 11 wherein the substantially electrically nonconductive material includes an encapsulation in the first recess segment and in the depression.
14. The system as claimed in claim 11 further comprising:
a tie bar having a slot with the tie bar connected to the paddle; and
wherein the substantially electrically nonconductive material includes an encapsulation through the slot and in the first recess segment.
15. The system as claimed in claim 11 wherein the substantially electrically nonconductive material includes an adhesive.
16. The system as claimed in claim 11 further comprising:
a tie bar connected to the paddle;
wherein:
the external interconnect having the lead tip and the lead body includes a lead tip bottom surface above a lead body bottom surface;
the device over the paddle top surface includes an integrated circuit die; and
the internal interconnect between the device and the external interconnect is connected to the lead tip.
17. The system as claimed in claim 16 wherein the internal interconnect is a solder bump.
18. The system as claimed in claim 16 wherein the internal interconnect is a bond wire.
19. The system as claimed in claim 16 wherein:
the tie bar has a slot;
the lead tip has a hole; and
the substantially electrically nonconductive material includes an encapsulation through the slot and the hole.
20. The system as claimed in claim 16 wherein:
the external interconnect includes:
the lead body having the second recess segment from the lead body top surface with the second recess segment perpendicular to the first recess segment, and
the lead tip having a hole;
the tie bar includes the tie bar having a slot; and
the substantially electrically nonconductive material includes an encapsulation through the slot, through the hole, and in the first recess segment.