Integrated circuit packaging system with flex tape and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a substrate; attaching a device to the substrate; providing interconnects on the substrate; and forming a flexible tape substantially conformal to the device and contacting the interconnects.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate;
attaching a device to the substrate;
providing an interconnect on the substrate; and
applying a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device.
2. The method as claimed in claim 1 wherein:
providing the substrate includes providing an interposer.
3. The method as claimed in claim 1 wherein:
applying the flexible tape includes the flexible tape having a slot adjacent and parallel to a side of the device.
4. The method as claimed in claim 1 further comprising:
providing an underfill between the device and the substrate.
5. The method as claimed in claim 1 wherein:
attaching the device to the substrate includes attaching one or more active devices, passive devices, or a combination thereof.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a substrate including a first side opposing a second side;
attaching a device to the first side of the substrate;
providing an interconnect on the first side of the substrate and an external terminal on the second side; and
applying a flexible tape in a step shaped configuration over the device and contacting the interconnect, the flexible tape bent over an edge of the device.
7. The method as claimed in claim 6 wherein:
applying the flexible tape includes configuring the flexible tape to include a first side with a first plane and a second plane.
8. The method as claimed in claim 6 further comprising:
providing a stiffener formed over the flexible tape.
9. The method as claimed in claim 6 further comprising:
providing a second package over and electrically contacting the flexible tape.
10. The method as claimed in claim 6 further comprising:
providing a second package over and electrically contacting the flexible tape through intermediate conductors.
11. An integrated circuit packaging system comprising:
a substrate;
a device over the substrate;
an interconnect on the substrate; and
a flexible tape over the device and contacting the interconnect, the flexible tape bent over an edge of the device.
12. The system as claimed in claim 11 wherein:
the substrate includes an interposer.
13. The system as claimed in claim 11 wherein:
the flexible tape includes the flexible tape having a slot adjacent and parallel to a side of the device.
14. The system as claimed in claim 11 further comprising:
an underfill between the device and the substrate.
15. The system as claimed in claim 11 further comprising:
an adhesive between the device and the flexible tape.
16. The system as claimed in claim 11 further comprising:
the substrate including a first side opposing a second side;
the device over the first side of the substrate;
the interconnect connected on the first side of the substrate and an external terminal connected on the second side; and
the flexible tape configured in a step shape.
17. The system as claimed in claim 16 wherein:
the flexible tape further includes a first side with a first plane and a second plane.
18. The system as claimed in claim 16 further comprising:
a stiffener over the flexible tape.
19. The system as claimed in claim 16 further comprising:
a second package over and electrically contacting the flexible tape.
20. The system as claimed in claim 16 further comprising:
a second package over and electrically contacting the flexible tape through intermediate conductors.