IP Library Granted Patent US 7,977,970
Granted Patent B2
US 7,977,970 · App. 12/794,279 · Granted Jul 12, 2011

Enhanced field programmable gate array

Assignee: Actel Corporation
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 7,977,970
App. No.
12/794,279
Granted
Jul 12, 2011
Kind
B2
Abstract

An enhanced performance field programmable gate array integrated circuit comprises a field programmable gate array and other functional circuitry such as a mask-programmable gate array in the same integrated circuit. A circuit interface provides communication between the field programmable gate array, the mask-programmable gate array and the integrated circuit I/O.

Claims (25)

1. An integrated circuit device having a plurality of regions, comprising:

at least one field programmable gate array region, the at least one field programmable gate array region including at least one high fanout load

at least one hardwired circuit region including as least one high drive-low skew clock driver circuit for connecting to the at least one high fanout load;

an interface region including a plurality of interface circuit elements providing communication between the at least one field programmable gate array region and the at least one hardwired circuit region;

an input/output system including I/O pads and associated driver circuits for providing input/output to the integrated circuit device;

a user-programmable interconnect architecture for selectively making connections between the input/output system, the at least one field programmable gate array region, and the at least one hardwired circuit region.

2. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one decryption circuit that produces a decrypted configuration data signal from an encrypted configuration data signal received as an input and wherein the at least one field programmable gate array region comprises at least one configuration control circuit that utilizes the decrypted configuration data signal to configure the at least one field programmable gate array region to perform a user programmed function.

3. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one dynamic reprogramming circuit to allow selective portions of the at least one field programmable gate array region to be reprogrammed.

4. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one logic function for providing a built-in test sequence to the at least one field programmable gate array region.

5. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one bus interface circuit for providing a link between an external user system and the at least one field programmable gate array region.

6. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one local network interface circuit for providing a link between an external user system and the at least one field programmable gate array region.

7. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one microprocessor controller.

8. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises at least one bus controller.

9. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises an analog circuit block.

10. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises a memory.

11. The integrated circuit device of claim 1 , wherein the at least one hardwired circuit region comprises a specialized I/O function.

12. The integrated circuit device of claim 1 , wherein:

the at least one field programmable gate array region includes at least one high fanout load; and

the at least one hardwired circuit region includes at least one high drive-low skew clock driver circuit for connecting to the at least one high fanout load.

13. The integrated circuit device of claim 1 , wherein at least one of the interface circuit elements in the interface region is a three-state buffer.

14. The integrated circuit device of claim 1 , wherein at least one of the interface circuit elements in the interface region is a high-voltage pass gate.

15. The integrated circuit device of claim 1 , wherein at least one of the interface circuit elements in the interface region is a direct connection.

16. The integrated circuit device of claim 1 , further including an I/O interface coupled between at least one of the I/O pads and one of the at least one field programmable gate array region and the at least one hardwired circuit region.

17. The integrated circuit device of claim 15 , wherein the I/O interface is a logic module that conditions signals in at least one of input and output communications carried on by the integrated circuit device.

18. The integrated circuit device of claim 15 , wherein the I/O interface is a logic module that controls at least one of input and output communications carried on by the integrated circuit device.

Assignments (7)
RELEASE OF SECURITY INTEREST Recorded May 29, 2018
From: MORGAN STANLEY SENIOR FUNDING, INC.
To: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.), INC.; MICROSEMI FREQUENCY AND TIME CORPORATION; MICROSEMI COMMUNICATIONS, INC.; MICROSEMI SOC CORP.; MICROSEMI CORP. - POWER PRODUCTS GROUP; MICROSEMI CORP. - RF INTEGRATED SOLUTIONS
Reel/Frame 046251/0391 →
PATENT SECURITY AGREEMENT Recorded Feb 3, 2016
From: MICROSEMI CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC. (F/K/A LEGERITY, INC., ZARLINK SEMICONDUCTOR (V.N.) INC., CENTELLAX, INC., AND ZARLINK SEMICONDUCTOR (U.S.) INC.); MICROSEMI FREQUENCY AND TIME CORPORATION (F/K/A SYMMETRICON, INC.); MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION); MICROSEMI SOC CORP. (F/K/A ACTEL CORPORATION); MICROSEMI CORP. - POWER PRODUCTS GROUP (F/K/A ADVANCED POWER TECHNOLOGY INC.); MICROSEMI CORP. - RF INTEGRATED SOLUTIONS (F/K/A AML COMMUNICATIONS, INC.)
To: MORGAN STANLEY SENIOR FUNDING, INC.
Reel/Frame 037691/0697 →
RELEASE OF SECURITY INTEREST Recorded Jan 19, 2016
From: BANK OF AMERICA, N.A.
To: MICROSEMI CORPORATION; MICROSEMI CORP.-ANALOG MIXED SIGNAL GROUP, A DELAWARE CORPORATION; MICROSEMI SOC CORP., A CALIFORNIA CORPORATION; MICROSEMI SEMICONDUCTOR (U.S.) INC., A DELAWARE CORPORATION; MICROSEMI FREQUENCY AND TIME CORPORATION, A DELAWARE CORPORATION; MICROSEMI COMMUNICATIONS, INC. (F/K/A VITESSE SEMICONDUCTOR CORPORATION), A DELAWARE CORPORATION; MICROSEMI CORP.-MEMORY AND STORAGE SOLUTIONS (F/K/A WHITE ELECTRONIC DESIGNS CORPORATION), AN INDIANA CORPORATION
Reel/Frame 037558/0711 →
CHANGE OF NAME Recorded Dec 28, 2015
From: ACTEL CORPORATION
To: MICROSEMI SOC CORP.
Reel/Frame 037380/0504 →
NOTICE OF SUCCESSION OF AGENCY Recorded Apr 9, 2015
From: ROYAL BANK OF CANADA (AS SUCCESSOR TO MORGAN STANLEY & CO. LLC)
To: BANK OF AMERICA, N.A., AS SUCCESSOR AGENT
Reel/Frame 035657/0223 →
SUPPLEMENTAL PATENT SECURITY AGREEMENT Recorded Nov 11, 2011
From: MICROSEMI CORPORATION; MICROSEMI CORP. - ANALOG MIXED SIGNAL GROUP; MICROSEMI CORP. - MASSACHUSETTS; ACTEL CORPORATION
To: MORGAN STANLEY & CO. LLC
Reel/Frame 027213/0611 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2011
From: WHITE ELECTRONIC DESIGNS CORP.; ACTEL CORPORATION; MICROSEMI CORPORATION
To: MORGAN STANLEY & CO. INCORPORATED
Reel/Frame 025783/0613 →
Continuity (5)
Continuation 12111660 · Apr 29, 2008
Continuation 10916214 · Aug 10, 2004
Continuation 09819084 · Sep 25, 2000
Continuation 08807455 · Feb 28, 1997
Related Publication 20100244894A1 · Sep 30, 2010