Resistive RAM devices for programmable logic devices
View Patent ↗A resistive random access memory device formed on a semiconductor substrate comprises an interlayer dielectric having a via formed therethrough. A chemical-mechanical-polishing stop layer is formed over the interlayer dielectric. A barrier metal liner lines walls of the via. A conductive plug is formed in the via. A first barrier metal layer is formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug. A dielectric layer is formed over the first barrier metal layer. An ion source layer is formed over the dielectric layer. A dielectric barrier layer is formed over the ion source layer, and includes a via formed therethrough communicating with the ion source layer. A second barrier metal layer is formed over the dielectric barrier layer and in electrical contact with the ion source layer. A metal interconnect layer is formed over the barrier metal layer.
1. A resistive random access memory device formed on a semiconductor substrate and comprising:
an interlayer dielectric formed on the semiconductor substrate and having a via formed therethrough;
a chemical-mechanical-polishing stop layer formed over the interlayer dielectric, the via formed through the chemical-mechanical-polishing stop layer;
a barrier metal liner lining walls of the via;
a conductive plug formed in the via;
a first barrier metal layer formed over the chemical-mechanical-polishing stop layer and in electrical contact with the conductive plug;
a dielectric layer formed over the first barrier metal layer;
an ion source layer formed over the dielectric layer;
edges of the first barrier metal layer, the dielectric layer, and the ion source layer being in substantial alignment with each other to form an aligned stack disposed directly over the conductive plug, edges of the aligned stack extending beyond outer edges of the barrier metal liner;
a dielectric barrier layer formed over the aligned stack and at least a portion of the chemical-mechanical-polishing stop layer, the dielectric barrier layer including a via formed therethrough communicating with the ion source layer;
a second barrier metal layer formed over the dielectric barrier layer and in electrical contact with the ion source layer, the second barrier metal layer extending over at least a portion of the chemical-mechanical-polishing stop layer; and
a metal interconnect layer formed over the barrier metal layer.
2. The resistive random access memory device of claim 1 wherein the barrier metal liner, the first barrier metal layer, and the second barrier metal layer are formed from one of Ta, TaN, Ti, TiN, and W.
3. The resistive random access memory device of claim 1 wherein the chemical-mechanical-polishing stop layer is formed from one of SiN and SiC.
4. The resistive random access memory device of claim 1 wherein the dielectric layer is formed from one of GeS, a chalcogenide material, and a glass material.
5. The resistive random access memory device of claim 1 wherein the ion source is formed from Ag.
6. The resistive random access memory device of claim 1 wherein the metal interconnect layer is formed from one of Al, and Cu.
7. The resistive random access memory device of claim 1 wherein the dielectric barrier is formed from SiN and SiC.
8. The resistive random access memory device of claim 1 wherein the conductive plug is formed from W.
9. The resistive random access memory device of claim 1 further including a third barrier metal layer formed over the ion source material.
10. A resistive random access memory device formed on a semiconductor substrate and comprising:
an interlayer dielectric formed on the semiconductor substrate and having a via formed therethrough;
a chemical-mechanical-polishing stop layer formed over the interlayer dielectric, the via formed through the chemical-mechanical-polishing stop layer;
a barrier metal liner lining walls of the via;
a copper metal interconnect layer formed in the via;
a first barrier metal layer formed over the chemical-mechanical-polishing stop layer and in electrical contact with the copper metal interconnect layer;
a dielectric layer formed over the first barrier metal layer;
an ion source layer formed over the dielectric layer;
edges of the first barrier metal layer, the dielectric layer, and the ion source layer being in substantial alignment with each other to form an aligned stack disposed directly over the copper metal interconnect layer, edges of the aligned stack extending beyond outer edges of the barrier metal liner;
a dielectric barrier layer formed over the aligned stack and at least a portion of the chemical-mechanical-polishing stop, the dielectric barrier layer including a via formed therethrough communicating with the ion source layer;
a second barrier metal layer formed over the dielectric barrier layer and in electrical contact with the ion source layer; and
a metal interconnect layer formed over the barrier metal layer.
11. The resistive random access memory device of claim 10 wherein the barrier metal liner, the first barrier metal layer, and the second barrier metal layer are formed from one of Ta, TaN, Ti, TiN, and W.
12. The resistive random access memory device of claim 10 wherein the chemical-mechanical-polishing stop layer is formed from one of SiN and SiC.
13. The resistive random access memory device of claim 10 wherein the dielectric layer is formed from one of GeS, a chalcogenide material, and a glass material.
14. The resistive random access memory device of claim 10 wherein the ion source is formed from Ag.
15. The resistive random access memory device of claim 10 wherein the dielectric barrier is formed from one of SiN and SiC.
16. The resistive random access memory device of claim 10 further including a third barrier metal layer formed over the ion source material.