Integrated circuit package system with offset stacking and anti-flash structure
View Patent ↗An integrated circuit package system includes: a carrier; a device structure in an offset location over the carrier with the device structure having a bond pad and a contact pad; an electrical interconnect between the bond pad and the carrier; an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad; and a package encapsulation adjacent to the anti-flash structure and over the carrier.
1. An integrated circuit package system comprising:
a carrier;
a device structure in an offset location over the carrier with the device structure having a bond pad and a contact pad;
an electrical interconnect between the bond pad and the carrier;
an anti-flash structure over the device structure with the anti-flash structure exposing the contact pad, a portion of the electrical interconnect in contact and conformally enclosed by the anti-flash structure; and
a package encapsulation adjacent to the anti-flash structure and over the carrier.
2. The system as claimed in claim 1 wherein the device structure is an interposer.
3. The system as claimed in claim 1 wherein the device structure is an integrated circuit device.
4. The system as claimed in claim 1 wherein the anti-flash structure over the device structure includes the anti-flash structure over a portion of the electrical interconnect over the bond pad.
5. The system as claimed in claim 1 further comprising a first integrated circuit device over the carrier.
6. The system as claimed in claim 1 further comprising:
an integrated circuit device over the carrier;
a passive device over the carrier; and
wherein the anti-flash structure is on the device structure.
7. The system as claimed in claim 6 further comprising:
an integrated circuit die over the carrier; and
wherein the device structure over the carrier includes:
the device structure over the integrated circuit die.
8. The system as claimed in claim 6 wherein the anti-flash structure includes the anti-flash structure over a side of the device structure onto the carrier.
9. The system as claimed in claim 6 wherein the device structure in the offset location over the carrier includes the device structure with a side of the device structure not parallel to an edge of the carrier.
10. The system as claimed in claim 6 further comprising a mounting device over the device structure within the anti-flash structure.