Integrated circuit packaging system with shaped lead and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit packaging system includes: forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface; forming a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface; attaching an integrated circuit die to the die attach paddle; connecting a conductive connector to the integrated circuit die and the package lead; and applying an encapsulation over the integrated circuit die, the encapsulation conformed to the retention structure and exposing a portion of the package lead.
1. A method of manufacture of an integrated circuit packaging system comprising:
forming a package lead having:
a first retention structure around a perimeter of the package lead with a first concave surface, a first ridge, and a second concave surface, wherein the second concave surface is separated from the first concave surface by the first ridge; and
a first flared shaped region and a third concave surface, wherein the third concave surface is separated from the second concave surface by the first flared shaped region, the first flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the package lead;
forming a die attach paddle adjacent the package lead, the die attach paddle having:
a second retention structure around a perimeter of the die attach paddle having a fourth concave surface, a second ridge, and a fifth concave surface, wherein the fifth concave surface is separated from the fourth concave surface by the second ridge; and
a second flared shaped region and a sixth concave surface, wherein the sixth concave surface is separated from the fifth concave surface by the second flared shaped region, the second flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the die attach paddle;
attaching an integrated circuit die to the die attach paddle;
connecting a conductive connector to the integrated circuit die and the package lead; and
applying an encapsulation over the integrated circuit die, the encapsulation conforming to the first retention structure and exposing a portion of the package lead.
2. The method as claimed in claim 1 wherein applying the encapsulation includes exposing the first flared shaped region of the package lead.
3. The method as claimed in claim 1 wherein forming the package lead includes forming the package lead with an encapsulated lead length greater than twice an exposed lead length.
4. The method as claimed in claim 1 further comprising applying a conductive plating over opposite ends of the package lead.
5. A method of manufacture of an integrated circuit packaging system comprising:
forming a package lead having:
a first retention structure around a perimeter of the package lead with a first concave surface, a first ridge, and a second concave surface, wherein the second concave surface is separated from the first concave surface by the first ridge; and
a first flared shaped region and a third concave surface, wherein the third concave surface is separated from the second concave surface by the first flared shaped region, the first flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the package lead;
forming a die attach paddle adjacent the package lead, the die attach paddle having:
a second retention structure around a perimeter of the die attach paddle having a fourth concave surface, a second ridge, and a fifth concave surface, wherein the fifth concave surface is separated from the fourth concave surface by the second ridge; and
a second flared shaped region and a sixth concave surface, wherein the sixth concave surface is separated from the fifth concave surface by the second flared shaped region, the second flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the die attach paddle;
attaching an integrated circuit die to the die attach paddle;
connecting a conductive connector to the integrated circuit die and the package lead; and
applying an encapsulation over the integrated circuit die, the encapsulation conforming to the first retention structure and the second retention structure, and exposing a portion of the package lead and of the die attach paddle,
6. The method as claimed in claim 5 wherein applying the encapsulation includes exposing the second flared shaped region of the die attach paddle.
7. The method as claimed in claim 5 wherein forming the die attach paddle includes forming the die attach paddle with an encapsulated lead length greater than twice an exposed lead length.
8. The method as claimed in claim 5 further comprising applying a conductive plating over opposite ends of the die attach paddle.
9. An integrated circuit packaging system comprising:
a package lead having:
a first retention structure around a perimeter of the package lead, the first retention structure with a first concave surface, a first ridge, and a second concave surface, the second concave surface separated from the first concave surface by the first ridge;
a first flared shaped region and a third concave surface, wherein the third concave surface is separated from the second concave surface by the first flared shaped region, the first flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the package lead;
a die attach paddle adjacent the package lead and having:
a second retention structure around a perimeter of the die attach paddle with a fourth concave surface, a second ridge, and a fifth concave surface, wherein the fifth concave surface is separated from the four concave surface by the second ridge; and
a second flared shaped region and a sixth concave surface, wherein the sixth concave surface is separated from the fifth concave surface by the second flared shaped region, the second flared shaped region having a body cross-sectional area greater than any other horizontal cross-section of the die attach paddle;
an integrated circuit die attached to the die attach paddle;
a conductive connector connected to the integrated circuit die and the package lead; and
an encapsulation over the integrated circuit die and conformal to the first retention structure, a portion of the package lead exposed from the encapsulation.
10. The system as claimed in claim 9 wherein the encapsulation exposes the first flared shaped region of the package lead.
11. The system as claimed in claim 9 wherein the package lead includes the package lead with an encapsulated lead length greater than twice an exposed lead length.
12. The system as claimed in claim 9 further comprising a conductive plating over opposite ends of the package lead.
13. The system as claimed in claim 9 wherein the die attach paddle includes a portion of the die attach paddle exposed from the encapsulation.
14. The system as claimed in claim 13 wherein the encapsulation exposes the second flared shaped region of the die attach paddle.
15. The system as claimed in claim 13 wherein the die attach paddle includes the die attach paddle with an encapsulated lead length greater than twice an exposed lead length.
16. The system as claimed in claim 13 further comprising a conductive plating over opposite ends of the die attach paddle.