Integrated circuit package system with redistribution layer and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package system includes: providing a base device; attaching a base interconnect to the base device; applying an encapsulant over the base device and the base interconnect; and forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
1. A method for manufacturing an integrated circuit package system comprising:
providing a base device,
attaching a base interconnect to the base device, wherein attaching the base interconnect includes forming a base ball-end substantially coplanar to a plane of a base back side of the base device,
applying an encapsulant over the base device and the base interconnect; and
forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
2. The method as claimed in claim 1 wherein attaching the base device further includes attaching more than one of a through-silicon-via device.
3. The method as claimed in claim 1 further comprising attaching a stack device over the base device.
4. A method for manufacturing an integrated circuit package system comprising:
providing a base device having a base front side and a base back side;
attaching a base interconnect to the base front side and having a base ball-end near the base back side;
applying an encapsulant over the base device and the base interconnect with the base back side and the base ball-end substantially exposed;
forming a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate; and
attaching a package connector over a side of the re-routing film opposite the base device.
5. The method as claimed in claim 4 wherein applying the encapsulant includes forming an encapsulant cavity on a side opposite the re-routing film.
6. The method as claimed in claim 4 further comprising applying a wire-in-film material over the base device.
7. The method as claimed in claim 4 further comprising attaching a stack device over the base device wherein a stack connector of the stack device is on a side opposite the base device.
8. The method as claimed in claim 4 further comprising attaching a stack device over the base device wherein the stack device is an integrated circuit package.
9. An integrated circuit package system comprising:
a base device,
a base interconnect connected to the base device, wherein the base interconnect includes a base ball-end substantially coplanar to a plane of a base back side of the base device;
an encapsulant over the base device and the base interconnect; and
a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate.
10. The system as claimed in claim 9 wherein the base device further includes more than one of a through-silicon-via device.
11. The system as claimed in claim 9 further comprising a stack device over the base device.
12. An integrated circuit package system comprising:
a base device having a base front side and a base back side;
a base interconnect connected to the base device, wherein the base interconnect is attached to the base front side and having a base ball-end near the base back side;
an encapsulant over the base device and the base interconnect, wherein the encapsulant is over the base device and the base interconnect with the base back side and the base ball-end substantially exposed;
a re-routing film over the encapsulant, the base device, and the base interconnect for connectivity without a substrate, wherein the re-routing film is over the encapsulant, the base back side, and the base ball-end for connectivity without a substrate; and
a package connector is over a side of the re-routing film opposite the base device.
13. The system as claimed in claim 12 wherein the encapsulant includes an encapsulant cavity on a side opposite the re-routing film.
14. The system as claimed in claim 12 further comprising a wire-in-film material over the base device.
15. The system as claimed in claim 12 further comprising a stack device over the base device wherein a stack connector of the stack device is on a side opposite the base device.
16. The system as claimed in claim 12 further comprising a stack device over the base device wherein the stack device is an integrated circuit package.