Method for forming and structure of a recessed source/drain strap for a MUGFET
View Patent ↗A method and semiconductor structure includes an insulator layer on a substrate, a plurality of parallel fins above the insulator layer, relative to a bottom of the structure. Each of the fins comprises a central semiconductor portion and conductive end portions. At least one conductive strap may be positioned within the insulator layer below the fins, relative to the bottom of the structure. The conductive strap can be perpendicular to the fins and contact the fins. The conductive strap further includes recessed portions disposed within the insulator layer, below the plurality of fins, relative to the bottom of the structure, and between each of the plurality of fins, and projected portions disposed above the insulator layer, collinear with each of the plurality of fins, relative to the bottom of the structure. The conductive strap is disposed in at least one of a source and a drain region of the semiconductor structure. A gate insulator contacts and covers the central semiconductor portion of the fins, and a gate conductor covers and contacts the gate insulator.
1. A semiconductor structure comprising:
an insulator layer on a substrate;
a plurality of parallel fins above said insulator layer, relative to a bottom of said semiconductor structure, each of said fins comprising a central semiconductor portion and conductive end portions;
at least one conductive strap positioned within said insulator layer below said fins, relative to said bottom of said structure, said conductive strap being perpendicular to said fins and contacting said fins, said at least one conductive strap including:
recessed portions disposed within said insulator layer, below said plurality of fins, relative to said bottom of said structure, and between each of said plurality of fins, and
projected portions extending into said fins, collinear with each of said plurality of fins, relative to said bottom of said structure;
a gate dielectric contacting and covering said central semiconductor portion of said fins; and
a gate conductor covering and contacting said gate dielectric,
wherein said conductive strap is disposed in at least one of a source and a drain region of said semiconductor structure.
2. The semiconductor structure according to claim 1 , said conductive strap comprising one of silicon component and a metal.
3. The semiconductor structure according to claim 1 , said conductive strap comprising a silicide portion.
4. The semiconductor structure according to claim 1 , said fins having a height, width, and length physical measures, said height being greater than said width and said length being greater than said height.
5. The semiconductor structure according to claim 1 , said conductive end portions of said fins comprising said source and said drain regions of said fins.
6. A semiconductor structure comprising:
an insulator layer on a substrate;
a plurality of parallel fins above said insulator layer, relative to a bottom of said semiconductor structure, each of said fins comprising a central semiconductor portion and conductive end portions;
at least one conductive strap positioned within said insulator layer below said fins, relative to said bottom of said structure, said conductive strap being perpendicular to said fins and electrically connecting and contacting said fins, said conductive strap producing physical strain within said central semiconductor portion of said fins, said at least one conductive strap including:
recessed portions disposed within said insulator layer, below said plurality of parallel fins, relative to said bottom of said structure, and between each of said plurality of parallel fins, and
projected portions extending into said fins, collinear with each of said plurality of parallel fins, relative to said bottom of said structure;
a gate dielectric contacting and covering said central semiconductor portion of said fins; and
a gate conductor covering and contacting said gate dielectric,
wherein said at least one conductive strap electrically connects and contacts said fins,
wherein said at least one conductive strap produces a physical strain within said central semiconductor portion of said plurality of parallel fins, and
wherein said conductive strap is disposed in at least one of a source and a drain region of said semiconductor structure.
7. The semiconductor structure according to claim 6 , said conductive strap comprising one of silicon component and a metal.
8. The semiconductor structure according to claim 6 , said conductive strap comprising a silicide portion.
9. The semiconductor structure according to claim 6 , said fins having a height, width, and length physical measures, said height being greater than said width and said length being greater than said height.
10. The semiconductor structure according to claim 6 , said conductive end portions of said fins comprising source and drain regions of said fins.