Integrated circuit packaging system with die paddles and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: forming a package paddle group having a first package paddle electrically isolated from a second package paddle; attaching an integrated circuit device on the first package paddle and the second package paddle; forming a standoff terminal adjacent the package paddle group and electrically connected to the integrated circuit device; connecting a paddle connector to the integrated circuit device and the first package paddle and another paddle connector to the integrated circuit device and the second package paddle; and forming an encapsulation over the integrated circuit device, the first package paddle, the second package paddle, and the standoff terminal, the encapsulation exposing a portion of the first package paddle, the second package paddle, and the standoff terminal.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a top side, a gap, a first non-horizontal side, and a second non-horizontal side, the first non-horizontal side facing the second non-horizontal side and separated from the second non-horizontal side by the gap;
attaching an integrated circuit device on the top side with a non-conductive adhesive, wherein the non-conductive adhesive is in the gap and directly on the first non-horizontal side and the second non-horizontal side;
connecting a plurality of paddle connectors between the integrated circuit device and the top side;
connecting a terminal connector between the integrated circuit device and the top side;
forming an encapsulation over the integrated circuit device, the plurality of the paddle connectors, the terminal connector, and the top side; and
forming the bottom side of the leadframe to form a first package paddle and a second package paddle under corners of the integrated circuit device with the plurality of the paddle connectors connected to the first package paddle and to form a standoff terminal smaller than the first package paddle with the terminal connector connected thereto.
2. The method as claimed in claim 1 wherein forming the bottom side of the leadframe includes forming the first package paddle and the second package paddle, wherein the first package paddle includes a first lower paddle end, the second package paddle includes a second lower paddle end, and the first lower paddle end and the second lower paddle end are exposed from the encapsulation.
3. The method as claimed in claim 1 further comprising connecting the first package paddle to a voltage level and the second package paddle to another voltage level different from the voltage level of the first package paddle.
4. The method as claimed in claim 1 wherein forming the bottom side of the leadframe includes forming the first package paddle having a size different from a size of the second package paddle.
5. The method as claimed in claim 1 further comprising connecting a third package paddle electrically to the integrated circuit device.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a leadframe having a top side, a gap, a first non-horizontal side, and a second non-horizontal side, the first non-horizontal side facing the second non-horizontal side and separated from the second non-horizontal side by the gap;
attaching an integrated circuit device on the top side with a non-conductive adhesive, wherein the non-conductive adhesive is in the gap and directly on the first non-horizontal side and the second non-horizontal side;
connecting a plurality of paddle connectors between the integrated circuit device and the top side;
connecting a plurality of terminal connectors between the integrated circuit device and the top side;
forming an encapsulation over the integrated circuit device, the plurality of the paddle connectors, the plurality of the terminal connectors, and the top side; and
forming the bottom side of the leadframe to form a first package paddle and a second package paddle under corners of the integrated circuit device with the plurality of the paddle connectors connected to the first package paddle and to form a plurality of standoff terminals around and smaller than the first package paddle with one of the plurality of the terminal connectors connected to one of the plurality of the standoff terminals.
7. The method as claimed in claim 6 wherein forming the bottom side of the leadframe includes forming the bottom side of the leadframe to form the first package paddle and the second package paddle, wherein the first package paddle includes a first lower paddle end, the second package paddle includes a second lower paddle end, and the first lower paddle end and the second lower paddle end are exposed and protruding from the encapsulation.
8. The method as claimed in claim 6 further comprising connecting the first package paddle to a ground and the second package paddle to another ground different from the ground of the first package paddle.
9. The method as claimed in claim 6 wherein forming the bottom side of the leadframe includes forming the first package paddle having a shape different from a shape of the second package paddle.
10. The method as claimed in claim 6 further comprising:
connecting a third package paddle electrically to the integrated circuit device; and wherein:
forming the bottom side of the leadframe includes forming the plurality of the standoff terminals, each of the plurality of the standoff terminals having an inner standoff width greater than an outer standoff width and smaller than the third package paddle.