Semiconductor device and method of laser-marking laminate layer formed over eWLB with tape applied to opposite surface
View Patent ↗A semiconductor device has a semiconductor die with a plurality of bumps formed on contact pads disposed over its active surface. An encapsulant is formed over the semiconductor die. An interconnect structure is formed over the semiconductor die and encapsulant. The semiconductor die is mounted to a translucent tape with the bumps embedded in the translucent tape. The translucent tape has layers of polyolefin, acrylic, and polyethylene terephthalate. A back surface of the semiconductor die undergoes backgrinding to reduce die thickness. The tape undergoes UV curing. A laminate layer is formed over the back surface of the semiconductor die. The laminate layer undergoes oven curing. The laminate layer is laser-marked while the tape remains applied to the bumps. The tape is removed after laser-marking the laminate layer. Alternately, the tape can be removed prior to laser-marking. The tape reduces die warpage during laser-marking.
1. A method of making a semiconductor device, comprising:
providing a translucent tape;
providing a semiconductor substrate;
depositing an encapsulant over the semiconductor substrate;
forming an interconnect structure over the semiconductor substrate and encapsulant, the interconnect structure including a redistribution layer and plurality of bumps coupled to the redistribution layer;
disposing the semiconductor substrate on the translucent tape with the bumps embedded in the translucent tape;
removing a portion of the semiconductor substrate and encapsulant opposite the interconnect structure;
forming a laminate layer over a surface of the semiconductor substrate and encapsulant opposite the interconnect structure;
laser-marking the laminate layer controlled by pattern recognition through the translucent tape with the bumps embedded in the translucent tape; and
removing the translucent tape after laser-marking the laminate layer.
2. The method of claim 1 , wherein the translucent tape reduces a substrate warpage during laser-marking.
3. The method of claim 1 , wherein the translucent tape includes layers of polyolefin, acrylic, and polyethylene terephthalate.
4. The method of claim 1 , further including ultraviolet curing the translucent tape.
5. The method of claim 1 , further including curing the laminate layer.
6. The method of claim 1 , wherein forming the interconnect structure includes:
forming a first insulating layer within a boundary of the semiconductor substrate;
forming a second insulating over the first insulating layer and encapsulant;
forming the redistribution layer over the second insulating layer; and
forming the bumps over the redistribution layer.
7. The method of claim 1 , wherein the translucent tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.
8. A method of making a semiconductor device, comprising:
providing a semiconductor die
depositing an encapsulant over the semiconductor die;
forming an interconnect structure over the semiconductor die and encapsulant, the interconnect structure including a conductive layer and plurality of bumps coupled to the conductive layer;
disposing the semiconductor die over a translucent tape with the bumps embedded in the translucent tape;
removing a portion of the semiconductor die and encapsulant opposite the interconnect structure;
forming a laminate layer directly on a surface of the semiconductor die and encapsulant opposite the translucent tape; and
marking a location on the laminate layer opposite the translucent tape, the marking location being determined by pattern recognition through the translucent tape.
9. The method of claim 8 , wherein the translucent tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.
10. The method of claim 8 , further including ultraviolet curing the translucent tape.
11. The method of claim 8 , further including curing the laminate layer.
12. The method of claim 8 , wherein forming the interconnect structure includes:
forming an insulating layer over the semiconductor die;
forming the conductive layer over the insulating layer; and
forming the bumps over the conductive layer.
13. A method of making a semiconductor device, comprising:
providing a semiconductor die;
depositing an encapsulant over the semiconductor die;
forming an interconnect structure including a plurality of bumps over the semiconductor die and encapsulant;
disposing the semiconductor die on a tape with the bumps embedded in the tape;
removing a portion of the semiconductor die and encapsulant opposite the interconnect structure;
forming a laminate layer over a surface of the semiconductor die and encapsulant opposite the interconnect structure;
laser-marking the laminate layer, wherein the tape reduces a die warpage during laser-marking; and
removing the tape.
14. The method of claim 13 , wherein the tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.
15. The method of claim 13 , further including ultraviolet curing the tape.
16. The method of claim 13 , further including curing the laminate layer.
17. The method of claim 13 , wherein the tape is optically translucent.
18. The method of claim 13 , wherein forming the interconnect structure includes:
forming an insulating layer over the semiconductor die;
forming a conductive layer over the insulating layer; and
forming the bumps over the conductive layer.
19. A method of making a semiconductor device, comprising:
providing a semiconductor substrate;
depositing an encapsulant over the semiconductor substrate;
forming an interconnect structure over the semiconductor substrate and encapsulant;
disposing the semiconductor substrate over a translucent tape;
removing a portion of the semiconductor substrate and encapsulant;
forming a laminate layer on a surface of the semiconductor substrate and encapsulant opposite the interconnect structure; and
marking a location on the laminate layer opposite the translucent tape, the marking location being determined by pattern recognition through the translucent tape.
20. The method of claim 19 , further including ultraviolet curing the translucent tape.
21. The method of claim 19 , further including curing the laminate layer.
22. The method of claim 19 , wherein forming the interconnect structure includes:
forming an insulating layer over the semiconductor substrate;
forming a conductive layer over the insulating layer; and
forming a plurality of bumps over the conductive layer.
23. The method of claim 22 , wherein the translucent tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.
24. A method of making a semiconductor device, comprising:
providing a semiconductor substrate;
depositing an encapsulant over the semiconductor substrate;
forming an interconnect structure including a plurality of bumps over the semiconductor substrate and encapsulant;
disposing the semiconductor substrate on a tape with the bumps embedded in the tape;
removing a portion of the semiconductor substrate and encapsulant;
forming a laminate layer over a surface of the semiconductor substrate and encapsulant opposite the interconnect structure;
laser-marking the laminate layer; and
removing the tape after laser-marking the laminate layer.
25. The method of claim 24 , further including ultraviolet curing the tape.
26. The method of claim 24 , further including curing the laminate layer.
27. The method of claim 24 , further including removing the tape before curing the laminate layer.
28. The method of claim 24 , wherein forming the interconnect structure includes:
forming an insulating layer over the semiconductor substrate;
forming a conductive layer over the insulating layer; and
forming the bumps over the conductive layer.
29. The method of claim 24 , wherein the tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.
30. A method of making a semiconductor device, comprising:
providing a semiconductor substrate;
depositing an encapsulant over the semiconductor substrate;
forming an interconnect structure over the semiconductor substrate and encapsulant;
providing a translucent tape;
disposing the semiconductor substrate over the translucent tape;
removing a portion of the semiconductor substrate and encapsulant;
forming a laminate layer on the encapsulant and the semiconductor substrate opposite the interconnect structure;
marking the laminate layer controlled by pattern recognition through the translucent tape; and
removing the tape after marking the laminate layer.
31. The method of claim 30 , further including curing the laminate layer.
32. The method of claim 31 , further including removing the tape before curing the laminate layer.
33. The method of claim 30 , wherein forming the interconnect structure includes:
forming an insulating layer over the semiconductor substrate;
forming a conductive layer over the insulating layer; and
forming a plurality of bumps over the conductive layer.
34. The method of claim 33 , wherein the translucent tape includes a base layer, adhesive layer, and resin layer with the bumps embedded in the resin layer.