Integrated circuit packaging system with protective coating and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

forming a lead-frame having a die attach paddle and a contact pad adjacent the die attach paddle, the die attach paddle and the contact pad connected by a link;

mounting an integrated circuit die over the die attach paddle;

forming a protrusion at a peripheral edge of the die attach paddle and an exposed edge about the contact pad by etching away the link between the contact pad and the die attach paddle, and forming a paddle recess in a bottom of the die attach paddle by partially etching a portion of the bottom of the die attach paddle spaced away from the peripheral edge of the die attach paddle;

molding a package body on the lead-frame and the integrated circuit die, including portions of the die attach paddle and the contact pad, the package body having an exposed bottom between the die attach paddle and the contact pad leaving the protrusion and the exposed edge exposed from the package body, and portions of the die attach paddle and the contact pad exposed and extending below the package body; and

depositing a solder-resistant layer on the protrusion, the exposed edge, and in the paddle recess, but not on bottoms of the lead-frame under the die attach paddle or the contact pad or the exposed bottom of the package body, the solder-resistant layer consists of an oxide of metal.

2. The method as claimed in claim 1 further comprising coupling an electrical interconnect between the integrated circuit die and the contact pad.

3. The method as claimed in claim 1 further comprising forming a recess in a top surface of the lead-frame by stamping, etching, or a combination thereof.

4. A method of manufacture of an integrated circuit packaging system comprising:

forming a lead-frame having a die attach paddle and contact pads adjacent the die attach paddle, the die attach paddle and the contact pads connected by links;

patterning a solder wettable area on a bottom of the lead-frame under the contact pads and the die attach paddle;

mounting an integrated circuit die over the die attach paddle including applying an adhesive between the die attach paddle and the integrated circuit die;

forming a protrusion at a peripheral edge of the die attach paddle and exposed edges about the contact pads by etching away the links between the contact pads and the die attach paddle, and forming a paddle recess in a bottom of the die attach paddle by partially etching a portion of the bottom of the die attach paddle spaced away from the peripheral edge of the die attach paddle;

molding a package body on the lead-frame and the integrated circuit die, including portions of the die attach paddle and the contact pads, the package body having exposed bottoms between the die attach paddle and the contact pads leaving the protrusion and the exposed edges exposed from the package body, and portions of the die attach paddle and the contact pads exposed and extending below the package body; and

depositing a solder-resistant layer on the protrusion, the exposed edges, and in the paddle recess, but not on bottoms of the lead-frame under the die attach paddle or the contact pads or the exposed bottom of the package body, the solder-resist layer consists of an oxide of metal.

5. The method as claimed in claim 4 further comprising coupling electrical interconnects between the integrated circuit die and the contact pads, the die attach paddle, or a combination thereof.

6. The method as claimed in claim 4 further comprising:

forming recesses in a top surface of the lead-frame by stamping, etching, or a combination thereof for forming the links; and

wherein:

molding the package body includes filling the recesses by the package body.

7. The method as claimed in claim 4 wherein depositing the solder-resistant layer includes depositing the oxide of metal as a ring surrounding the solder wettable area under the contact pads.

8. The method as claimed in claim 4 further comprising forming the protrusion includes forming a recess, in the lead-frame, having the protrusion in the sidewall by stamping and then etching.

9. An integrated circuit packaging system comprising:

a die attach paddle having a paddle recess in a bottom of the die attach paddle spaced away from a peripheral edge of the die attach paddle;

a protrusion at the peripheral edge of the die attach paddle;

a contact pad adjacent to the die attach paddle, the contact pad having an exposed edge;

an integrated circuit die mounted over the die attach paddle;

a package body molded on the integrated circuit die including portions of the die attach paddle and the contact pad, the package body having an exposed bottom between the die attach paddle and the contact pad, wherein portions of the die attach paddle and the contact pad extend below and are exposed from the package body, and wherein the protrusion and the exposed edge are exposed from the package body; and

a solder-resistant layer on the protrusion, the exposed edge, and in the paddle recess, but not on a bottom of the contact pad or the bottom of the die attach paddle or the exposed bottom of the package body, the solder-resistant layer consists of an oxide of metal.

10. The system as claimed in claim 9 further comprising an electrical interconnect between the integrated circuit die and the contact pad.

11. The system as claimed in claim 9 further comprising a bonding contact on a top of the contact pad.

12. The system as claimed in claim 9 further comprising:

a solder wettable area on the bottom of the contact pad and the bottom of the die attach paddle; and

an adhesive between the integrated circuit die and a top of the die attach paddle.

13. The system as claimed in claim 12 further comprising an electrical interconnect between the integrated circuit die and the contact pad, the die attach paddle, or a combination thereof.

14. The system as claimed in claim 12 further comprising a bonding contact on a top of the contact pad and the die attach paddle.

15. The system as claimed in claim 12 wherein the contact pad adjacent to the die attach paddle includes multiple rows of contact pads around the die attach paddle.

16. The system as claimed in claim 12 wherein the solder-resistant layer forms a ring surrounding the solder wettable area under the contact pads.