Integrated circuit packaging system with a shield and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

mounting a first integrated circuit over the substrate;

forming a ground ring pad on a first side of the substrate and adjacent to the first integrated circuit;

forming a conductive pad on a periphery of the substrate, the ground ring pad between the conductive pad and the first integrated circuit;

forming an encapsulant around the first integrated circuit and over the substrate; and

forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure, the shield structure in direct contact with the first integrated circuit and the shield structure is a continuous structure characteristic of a deposition process.

2. The method as claimed in claim 1 wherein:

forming the shield structure includes forming a protrusion.

3. The method as claimed in claim 1 wherein:

forming the ground pad continuously around the first integrated circuit and contacting the shield structure.

4. The method as claimed in claim 1 further comprising:

forming a via within the first integrated circuit for dissipating heat to the shield structure.

5. The method as claimed in claim 1 further comprising:

stacking a second integrated circuit over the first integrated circuit.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a substrate;

mounting a first integrated circuit over the substrate;

forming a ground ring pad on a first side of the substrate and adjacent to the first integrated circuit;

forming a conductive pad on a periphery of the substrate, the ground ring pad between the conductive pad and the first integrated circuit;

forming an encapsulant around the first integrated circuit and over the substrate with openings;

forming a shield structure within and over the encapsulant while simultaneously forming a vertical interconnect structure, the shield structure in direct contact with the first integrated circuit and the shield structure is a continuous structure characteristic of a deposition process; and

patterning the shield structure and the vertical interconnect structure to form a shield and a vertical interconnect.

7. The method as claimed in claim 6 wherein:

forming the ground pad non-continuously around the first integrated circuit and contacting the shield.

8. The method as claimed in claim 6 further comprising:

forming a redistribution layer between two of the vertical interconnects.

9. The method as claimed in claim 6 wherein:

forming the shield includes forming an electromagnetic interference shield.

10. The method as claimed in claim 6 wherein:

mounting the first integrated circuit includes forming a flip-chip device or a wire-bonded device.

11. An integrated circuit packaging system comprising:

a substrate;

a first integrated circuit over the substrate;

a ground ring pad on a first side of the substrate and adjacent to the first integrated circuit;

a conductive pad on a periphery of the substrate, the ground ring pad between the conductive pad and the first integrated circuit;

an encapsulant around the first integrated circuit and over the substrate with openings that expose the ground ring pad and the conductive pad; and

a shield within and over the encapsulant in contact with the ground ring pad, the shield in direct contact with the first integrated circuit and the shield is a continuous structure characteristic of a deposition process; and

a vertical interconnect within the encapsulant and in contact with the conductive pad.

12. The system as claimed in claim 11 wherein:

the shield includes a protrusion.

13. The system as claimed in claim 11 wherein:

the ground ring pad is configured continuously around the first integrated circuit.

14. The system as claimed in claim 11 further comprising:

a via within the first integrated circuit for dissipating heat to the shield.

15. The system as claimed in claim 11 wherein:

the ground ring pad is configured discontinuously around the first integrated circuit.

16. The system as claimed in claim 11 further comprising:

a second integrated circuit stacked over the first integrated circuit.

17. The system as claimed in claim 16 further comprising:

a redistribution layer between two of the vertical interconnects.

18. The system as claimed in claim 16 wherein:

the shield and the vertical interconnect include the same material.

19. The system as claimed in claim 16 wherein:

the shield includes an electromagnetic interference shield.

20. The system as claimed in claim 16 wherein:

the first integrated circuit includes a flip-chip device or a wire-bonded device.