Integrated circuit package system employing device stacking and method of manufacture thereof
View Patent ↗A method of manufacture of an integrated circuit package system that includes: providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system; stacking a first device, a second device, and a third device between and over the electrical interconnect system; connecting the first device and the second device to the inner lead-finger system; and connecting the third device to the outer lead-finger system.
1. A method of manufacture of an integrated circuit package system comprising:
providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system;
stacking a first device, a second device, and a third device between and over the electrical interconnect system;
connecting the first device and the second device to the inner lead-finger system; and
connecting the third device to the outer lead-finger system.
2. The method as claimed in claim 1 wherein:
providing the electrical interconnect system includes half etching or stamping the electrical interconnect system to form the inner lead-finger system.
3. The method as claimed in claim 1 further comprising:
exposing a first device backside to an external environment.
4. A method of manufacture of an integrated circuit package system comprising:
providing an electrical interconnect system including an inner lead-finger system and an outer lead-finger system over a support medium;
attaching a first device to the support medium within an opening defined by the inner lead-finger system;
connecting the first device to the inner lead-finger system;
connecting a second device to the inner lead-finger system;
attaching a third device to the second device;
connecting the third device to the outer lead-finger system;
removing the support medium; and
encapsulating the integrated circuit package system.
5. The method as claimed in claim 4 wherein:
providing the electrical interconnect system includes providing the inner lead-finger system with a wire bond contact and a bump contact.
6. The method as claimed in claim 4 wherein:
providing the electrical interconnect system includes providing the inner lead-finger system with a bump contact formed by a mesa and a groove.
7. The method as claimed in claim 4 further comprising:
forming an inter-device structure between the third device and the second device.
8. An integrated circuit package system comprising:
an electrical interconnect system including an inner lead-finger system and an outer lead-finger system;
a first device, a second device, and a third device between and over the electrical interconnect system;
the first device and the second device electrically connected to the inner lead-finger system; and
the third device electrically connected to the outer lead-finger system.
9. The system as claimed in claim 8 wherein:
the second device is a flip-chip device.
10. The system as claimed in claim 8 wherein:
the inner lead-finger system has a portion removed within the thickness direction.
11. The system as claimed in claim 8 wherein:
the first device includes a first device backside exposed to an external environment.
12. The system as claimed in claim 8 wherein:
the inner lead-finger system includes a wire bond contact and a bump contact.
13. The system as claimed in claim 8 wherein:
the inner lead-finger system includes a bump contact formed by a mesa and a groove.
14. The system as claimed in claim 8 wherein:
the first device is within an opening in the electrical interconnect system.
15. The system as claimed in claim 8 further comprising:
an inter-device structure between the third device and the second device.