Drop-mold conformable material as an encapsulation for an integrated circuit package system and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package system includes: providing an integrated circuit; mounting a lead on the periphery of the integrated circuit; connecting the integrated circuit to the lead with an interconnect; and forming a conformable material by pressing the conformable material on the integrated circuit, the lead, and the interconnect.
1. An integrated circuit package system comprising:
an integrated circuit;
a lead mounted on the periphery of the integrated circuit;
an interconnect connecting the integrated circuit to the lead; and
a conformable material pressed on the integrated circuit, the lead, and the interconnect with a lower portion of the integrated circuit and the bottom portion of the lead protruding from the bottom surface of the conformal material.
2. The system as claimed in claim 1 further comprising:
a stiffener attached to the conformable material.
3. The system as claimed in claim 1 further comprising:
a stiffener attached to the conformable material with an adhesive layer.