Semiconductor device and method of forming pad layout for flipchip semiconductor die
View Patent ↗A semiconductor device has a semiconductor die with a die pad layout. Signal pads in the die pad layout are located primarily near a perimeter of the semiconductor die, and power pads and ground pads are located primarily inboard from the signal pads. The signal pads are arranged in a peripheral row or in a peripheral array generally parallel to an edge of the semiconductor die. Bumps are formed over the signal pads, power pads, and ground pads. The bumps can have a fusible portion and non-fusible portion. Conductive traces with interconnect sites are formed over a substrate. The bumps are wider than the interconnect sites. The bumps are bonded to the interconnect sites so that the bumps cover a top surface and side surfaces of the interconnect sites. An encapsulant is deposited around the bumps between the semiconductor die and substrate.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die including a die pad layout comprising signal pads located in no more than two peripheral rows in a perimeter region of the semiconductor die, and power pads and ground pads located primarily in an inboard region of the semiconductor die from the signal pads;
forming a plurality of bumps over the signal pads, power pads, and ground pads of the semiconductor die;
providing a substrate;
forming a plurality of conductive traces including interconnect sites disposed over the substrate, the bumps over the signal pads, power pads, and ground pads of the semiconductor die being wider than the interconnect sites of the conductive traces;
mounting the semiconductor die to the substrate with the bumps over the signal pads, power pads, and ground pads of the semiconductor die being bonded to the interconnect sites over the substrate so that the bumps cover a top surface and side surfaces of the interconnect sites; and
depositing an encapsulant around the bumps between the semiconductor die and substrate.
2. The method of claim 1 , wherein the bumps include a fusible portion and non-fusible portion.
3. The method of claim 1 , further including arranging the signal pads in a peripheral array generally parallel to an edge of the semiconductor die.
4. The method of claim 1 , further including arranging the signal pads in adjacent rows in a staggered arrangement or orthogonal arrangement.
5. The method of claim 1 , wherein fewer than 10% of the power pads and ground pads are located within the perimeter region and fewer than 10% of the signal pads are located within the inboard region.
6. The method of claim 1 , further including forming a masking layer over an area of the substrate away from the interconnect sites.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate;
forming a plurality of conductive traces including interconnect sites over the substrate arranged in a layout comprising signal sites located in no more than two peripheral rows near a perimeter of the substrate, and power sites and ground sites located inboard from the signal sites over the substrate; and
forming an interconnect structure between the semiconductor die and substrate so that the interconnect structures cover a top surface and side surfaces of the signal sites, power sites, and ground sites over the substrate.
8. The method of claim 7 , further including depositing an encapsulant between the semiconductor die and substrate.
9. The method of claim 7 , wherein the interconnect structure includes a fusible portion and non-fusible portion.
10. The method of claim 7 , further including arranging the signal sites in a peripheral array generally parallel to an edge of the substrate.
11. The method of claim 7 , further including arranging the signal sites in adjacent rows in a staggered arrangement or orthogonal arrangement.
12. The method of claim 7 , further including arranging the power and ground sites in an array near a center of the substrate.
13. The method of claim 7 , wherein a central region of the semiconductor die has no pads.
14. A method of making a semiconductor device, comprising:
providing a semiconductor die;
providing a substrate;
forming a plurality of conductive traces including interconnect sites on the conductive traces and disposed over the substrate arranged in a layout comprising signal sites located primarily in a perimeter region of the substrate, and power sites and ground sites located primarily in an inboard region of the substrate from the signal sites;
bonding the semiconductor die to the interconnect sites with bumps wider than the interconnect sites on the conductive traces; and
depositing an encapsulant between the semiconductor die and substrate.
15. The method of claim 14 , further including forming an interconnect structure over the semiconductor die, the interconnect structure including a fusible portion and non-fusible portion.
16. The method of claim 14 , wherein fewer than 10% of the power sites and ground sites are located within the perimeter region.
17. The method of claim 14 , wherein fewer than 10% of the signal sites are located within the inboard region.
18. The method of claim 14 , further including arranging the signal sites in a peripheral row or in a peripheral array generally parallel to an edge of the substrate.
19. The method of claim 14 , further including arranging the power sites and ground sites in an array near a center of the substrate.
20. The method of claim 14 , further including arranging the signal sites in adjacent rows in a staggered arrangement or orthogonal arrangement.
21. A semiconductor device, comprising:
a semiconductor die including a die pad layout comprising signal pads located primarily in a perimeter region of the semiconductor die, and power pads and ground pads located primarily in an inboard region of the semiconductor die from the signal pads;
a substrate;
a plurality of conductive traces including interconnect sites formed over the substrate;
interconnects comprising a width greater than a width of the interconnect sites are bonded to the semiconductor die and interconnect sites; and
an encapsulant deposited between the semiconductor die and substrate.
22. The semiconductor device of claim 21 , wherein the interconnects include a fusible portion and non-fusible portion.
23. The semiconductor device of claim 21 , wherein fewer than 10% of the power pads and ground pads are located within the perimeter region.
24. The semiconductor device of claim 21 , wherein the signal pads are arranged in adjacent rows in a staggered arrangement or orthogonal arrangement.
25. The semiconductor device of claim 21 , wherein the signal pads are arranged in no more than two rows.
26. A semiconductor device, comprising:
a semiconductor die including a die pad layout comprising signal pads located primarily in a perimeter region of the semiconductor die, and power pads and ground pads located primarily in an inboard region of the semiconductor die from the signal pads;
a substrate;
a plurality of conductive traces including interconnect sites formed over the substrate;
bumps bonded to the semiconductor die and to a top surface and side surfaces of the interconnect sites; and
an encapsulant deposited between the semiconductor die and substrate.
27. The semiconductor device of claim 26 , wherein the bumps include a fusible portion and non-fusible portion.
28. The semiconductor device of claim 26 , wherein fewer than 10% of the power pads and ground pads are located within the perimeter region.
29. The semiconductor device of claim 26 , wherein the signal pads are arranged in adjacent rows in a staggered arrangement or orthogonal arrangement.
30. The semiconductor device of claim 26 , wherein the signal pads are arranged in a peripheral row or in a peripheral array generally parallel to an edge of the substrate.
31. The semiconductor device of claim 26 , wherein the power pads and ground pads are arranged in an array near a center of the substrate.