Integrated circuit packaging system with lead frame etching and method of manufacture thereof

1. A method of manufacture of an integrated circuit packaging system comprising:

providing a pre-plated leadframe having a contact pad and a die paddle pad;

forming an isolated contact from the pre-plated leadframe and the contact pad;

mounting an integrated circuit die over the die paddle pad; and

encapsulating with an encapsulation the integrated circuit die and the isolated contact, the encapsulation having a bottom surface which is planar and exposing only the contact pad and the die paddle pad, the isolated contact having protrusions having concave surfaces merging at an edge fully within the encapsulation.

2. The method as claimed in claim 1 wherein providing the pre-plated leadframe includes:

providing the pre-plated leadframe etched partially through a system side on areas not covered by the contact pad and the die paddle pad.

3. The method as claimed in claim 1 wherein mounting an integrated circuit die includes:

attaching with a die attach adhesive the integrated circuit die to the die paddle pad; and

connecting with bond wires the integrated circuit die to the isolated contact.

4. The method as claimed in claim 1 wherein forming the isolated contact includes:

mounting on an adhesive film the pre-plated leadframe; and

removing the pre-plated leadframe between the contact pad and the die paddle pad.

5. The method as claimed in claim 1 wherein forming the isolated contact includes:

forming the isolated contact with protrusions on the sides of the isolated contact having concave surfaces merging to a point and interlocking with the encapsulation.

6. A method of manufacture of an integrated circuit packaging system comprising:

providing a pre-plated leadframe having a contact pad and a die paddle pad;

mounting the pre-plated leadframe on an adhesive film;

forming an isolated contact from the pre-plated leadframe and the contact pad;

mounting an integrated circuit die on the die paddle pad; and

encapsulating with an encapsulation the integrated circuit die and the isolated contact, the encapsulation having a bottom surface coplanar with the contact pad and the die paddle pad, and the encapsulation leaving exposed only the contact pad and the die paddle pad, the isolated contact having concave surfaces merging at an edge fully within the encapsulation.

7. The method as claimed in claim 6 wherein mounting the pre-plated leadframe on an adhesive film includes:

mounting a system side of the pre-plated leadframe on the adhesive film.

8. The method as claimed in claim 6 further comprising:

removing the adhesive film exposing only the contact pad, the die paddle pad, and the bottom surface of the encapsulation.

9. The method as claimed in claim 6 wherein forming the isolated contact includes:

forming instances of the isolated contact in staggered rows.

10. The method as claimed in claim 6 wherein providing the pre-plated leadframe includes:

providing the contact pad and the die paddle pad deposited on a component side and a system side of the pre-plated leadframe.

11. An integrated circuit packaging system comprising:

a die paddle having a die paddle body and a die paddle pad on top and bottom of the die paddle body;

an isolated contact having a contact body and a contact pad on the top and bottom of the contact body;

an integrated circuit die attached to the die paddle pad; and

an encapsulation having a bottom surface which is planar and exposing in the bottom surface only the contact pad and the die paddle pad, the isolated contact having protrusions having concave surfaces merging at an edge fully within the encapsulation.

12. The system as claimed in claim 11 wherein the bottom surface of the encapsulation has a texture matching the texture of an adhesive film.

13. The system as claimed in claim 11 further comprising:

a die attach adhesive between and on the integrated circuit die and the die paddle pad; and

bond wires connecting the integrated circuit die and the isolated contact.

14. The system as claimed in claim 11 wherein the isolated contact is vertically and horizontal symmetrical.

15. The system as claimed in claim 11 wherein the isolated contact has protrusions formed by the merging of two concave surfaces on the sides of the contact body, the concave surfaces coming to a point and interlocking with the encapsulation.

16. The system as claimed in claim 11 further comprising:

a die attach adhesive between the integrated circuit die and the die paddle pad;

bond wires connecting the integrated circuit die and the isolated contact; wherein:

the bottom surface of the encapsulation has a texture matching the texture of an adhesive film;

the isolated contact is vertically and horizontal symmetrical; and

the isolated contact has protrusions formed by the merging of two concave surfaces on the sides of the contact body, the concave surfaces coming to a point and interlocking with the encapsulation.

17. The system as claimed in claim 16 wherein the isolated contact is embedded in the encapsulation with only the contact pad exposed.

18. The system as claimed in claim 16 wherein the contact body and the die paddle body are formed from copper.

19. The system as claimed in claim 16 wherein the contact pad and the die paddle pad are made from metals or alloys comprising gold, nickel, and silver.

20. The system as claimed in claim 16 wherein the encapsulation has planar vertical edges.