Integrated circuit package-in-package system with wire-in-film encapsulant and method for manufacturing thereof

1. A method for manufacturing a multiple encapsulation integrated circuit package-in-package system comprising;

dicing a top integrated circuit wafer having a bottom encapsulant thereon to form a top integrated circuit die with the bottom encapsulant;

positioning internal leadfingers adjacent and connected to a bottom integrated circuit die;

pressing the bottom encapsulant on to the bottom integrated circuit die;

connecting the top integrated circuit die to external leadfingers adjacent the internal leadfingers; and

forming a top encapsulant over the top integrated circuit die.

2. The method as claimed in claim 1 wherein forming the top encapsulant includes:

placing the top encapsulant over a stiffener; and

pressing the stiffener and the top encapsulant over the top integrated circuit die.

3. The method as claimed in claim 1 wherein forming the top encapsulant includes:

molding a mold compound around the around the top integrated circuit die, the bottom encapsulant and the internal leadfingers.

4. The method as claimed in claim 1 further comprising.

positioning the bottom integrated circuit die, the internal lead fingers, and the external lead fingers on a carrier before pressing the bottom encapsulant on to the bottom integrated circuit die;

removing the carrier; and

dicing the top encapsulant, the bottom encapsulant, and the external leadfingers.

5. The method as claimed in claim 1 wherein placing the internal leadfingers includes:

placing a die attach paddle among the internal leadfingers; and

mounting the bottom integrated circuit on the die attach paddle.

6. A method for manufacturing a multiple encapsulation integrated circuit package-in-package system comprising:

bonding a bottom encapsulant on to a top integrated circuit wafer;

dicing the top integrated circuit wafer with the bottom encapsulant to form a top integrated circuit die with the bottom encapsulant;

positioning internal leadfingers adjacent and connected to a bottom integrated circuit die;

placing external leadfingers adjacent the internal leadfingers;

pressing the top die with the bottom encapsulant on to the bottom integrated circuit die to form a bottom package;

curing the bottom encapsulant;

connecting the top integrated circuit die to the external leadfingers; and

forming a top encapsulant over the top integrated circuit die and the external leadfingers.

7. The method as claimed in claim 6 wherein forming the top encapsulant includes:

placing an adhesive layer on a stiffener;

placing a buffer layer on the adhesive layer;

placing the top encapsulant on the buffer layer;

pressing the stiffener down on the top integrated circuit die to encapsulate the bottom package; and

curing the top encapsulant.

8. The method as claimed in claim 6 wherein:

pressing the top die with the bottom encapsulant on to the bottom integrated circuit die leaves a portion of the internal leadfingers extending from the bottom encapsulant; and

interconnecting the internal leadfingers and the external leadfingers.

9. The method as claimed in claim 6 wherein forming the top encapsulant includes:

placing a heat sink having a protrusion over the bottom package with the protrusion adjacent the top integrated circuit die.

10. The method as claimed in claim 6 wherein:

pressing the top die with the bottom encapsulant on to the bottom integrated circuit die leaves the bottom of the internal leadfingers protruding; and

forming the top encapsulant over the external leadfingers leaves the bottom of the external leadfingers protruding.