Integrated circuit packaging system with routed circuit lead array and method of manufacture thereof
A method of manufacture of an integrated circuit packaging system includes: providing a terminal having a top with a depression; applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom; forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and connecting an integrated circuit to the terminal through the trace.
1. A method of manufacture of an integrated circuit packaging system comprising:
providing a terminal having a top with a depression;
applying a dielectric material in the depression, the dielectric material having a gap formed therein and exposing a portion of the top therefrom is in direct contact with a peripheral portion at a plateau of the terminal;
forming a trace within the gap and in direct contact with the top, the trace extending laterally over an upper surface of the dielectric material; and
connecting an integrated circuit to the terminal through the trace.
2. The method as claimed in claim 1 further comprising:
providing a die pad; and
applying a contact layer below the die pad; and
wherein:
forming the trace includes forming a perimeter trace around the die pad; and further comprising:
mounting the integrated circuit to the die pad.
3. The method as claimed in claim 1 further comprising mounting the integrated circuit above the trace extending beyond the integrated circuit.
4. The method as claimed in claim 1 wherein:
forming the trace includes forming multiple traces; and further comprising:
mounting the integrated circuit above the multiple traces terminating at a non-uniform distance from the integrated circuit.
5. The method as claimed in claim 1 further comprising mounting the integrated circuit above the trace extending below the integrated circuit from the terminal beyond the integrated circuit.
6. A method of manufacture of an integrated circuit packaging system comprising:
providing a terminal having a top with a plateau and a depression extending from the plateau to a maximum width, the terminal further having a bottom portion with a dent extending from the maximum width to a base;
applying a contact layer directly to the base of the terminal;
forming a dielectric material in the depression and in direct contact with the plateau and extending to the maximum width, the dielectric material having a gap formed therein and exposing a portion of the plateau therefrom is in direct contact with a peripheral portion at a plateau of the terminal;
forming a trace within the gap and in direct contact with the plateau, the trace extending laterally over an upper surface of the dielectric material;
connecting an integrated circuit to the terminal through the trace; and
encapsulating the trace and the integrated circuit with an encapsulation.
7. The method as claimed in claim 6 wherein applying the contact layer includes applying the contact layer directly to a portion of the dent of the terminal near the base leaving a portion of the dent near the maximum width exposed.
8. The method as claimed in claim 6 further comprising forming a dimpled surface in the terminal centered in the base.
9. The method as claimed in claim 6 further comprising forming solder balls below the base and attached to the contact layer.
10. The method as claimed in claim 6 wherein connecting the integrated circuit to the terminal includes connecting the integrated circuit with a bond wire or with a solder ball.