Thin package system with external terminals and method of manufacture thereof

1. A method of manufacture of a thin package system with external terminals, comprising:

providing a leadframe;

providing a template for defining an external bond finger;

forming external bond fingers in the template on the leadframe;

forming land pad terminals by a first multi-layer plating;

providing a die;

attaching the die to the land pad terminals above the leadframe with an adhesive on the leadframe;

covering an encapsulant over at least portions of the die and the external bond fingers; and

removing the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.

2. The method as claimed in claim 1 wherein the leadframe is a copper alloy leadframe.

3. The method as claimed in claim 1 wherein:

providing the template for defining the external bond finger includes providing the template for defining a ground plane; and

further comprising:

forming the ground plane on the leadframe with the template.

4. The method as claimed in claim 1 wherein:

providing the template for defining the external bond finger includes providing the template for defining land pad terminals; and

attaching the die above the leadframe includes connecting the die electrically to the land pad terminals.

5. The method as claimed in claim 1 wherein using the template to form external bond fingers includes plating a second multi-layer plating having a first layer of about 0.003 μm gold, a second layer of about 0.1 μm palladium, a third layer of about 5.0 μm nickel, and a fourth layer of about 0.5 μm palladium.

6. A method of manufacture of a thin package system with external terminals, comprising:

providing a leadframe;

forming a resist on the leadframe, the resist having openings therethrough;

plating external bond fingers on the leadframe in the openings through the resist;

removing the resist;

forming land pad terminals by a first multi-layer plating;

providing a die having terminal pads;

attaching the die to the land pad terminals above the leadframe with an adhesive;

wire bonding the die to the external bond fingers with gold stud bumps connecting leadframe wires to the terminal pads on the die and gold stud bumps connecting the leadframe wires to the external bond fingers;

covering an encapsulant over at least portions of the die and the external bond fingers; and

dissolving the leadframe leaving a surface of the adhesive coplanar with a surface of the encapsulant.

7. The method as claimed in claim 6 wherein the leadframe is a copper alloy leadframe.

8. The method as claimed in claim 6 wherein:

forming the resist includes forming the resist with a ground plane opening therein; and

plating the external bond fingers includes forming a ground plane in the ground plane opening in the resist.

9. The method as claimed in claim 6 wherein:

forming the resist includes forming the resist with land pad terminal openings therein;

forming the land pad terminals includes forming land pad terminals in the land pad terminal openings in the resist; and

attaching the die above the leadframe further comprises connecting the die electrically to the land pad terminals.

10. The method as claimed in claim 6 wherein plating the external bond fingers onto the leadframe includes plating a second multi-layer plating having a first layer of about 0.003 μm gold, a second layer of about 0.1 μm palladium, a third layer of about 5.0 μm nickel, and a fourth layer of about 0.5 μm palladium.

11. A thin package system with external terminals, comprising:

external bond fingers having the characteristics of having been formed on a leadframe by a template;

land pad terminals formed from a first multi-layer plating, adjacent to the external bondfingers;

a die on the land pad terminals having the characteristics of having been attached to the leadframe;

an adhesive around the land pad terminals and under the die; and

an encapsulant over at least portions of the die and the external bond fingers, a surface of adhesive coplanar with a surface of the encapsulant.

12. The system as claimed in claim 11 wherein the characteristics of having been formed on and attached to a leadframe includes the characteristics of having been formed on and attached to a copper alloy leadframe.

13. The system as claimed in claim 11 further comprising a ground plane covered by the encapsulant having the characteristics of having been formed on the leadframe.

14. The system as claimed in claim 11 wherein the land pad terminals are connected electrically to the die and have the characteristics of having been formed on the leadframe, the characteristics including the land pad terminals having a vertically straight side.

15. The system as claimed in claim 11 wherein the external bond fingers include a second multi-layer plating having a first layer of about 0.003 μm gold, a second layer of about 0.1 μm palladium, a third layer of about 5.0 μm nickel, and a fourth layer of about 0.5 μm palladium.

16. The system as claimed in claim 11 further comprising:

leadframe wires and gold stud bumps wire bonding the terminal pads on the die to the external bond fingers; and

wherein:

the external bond fingers having the characteristics of having been formed on the leadframe by plating through openings in a resist; and

the adhesive exposing a layer of the first multi-layer plating from the adhesive.

17. The system as claimed in claim 16 wherein the external bond fingers have a vertically straight side.

18. The system as claimed in claim 16 wherein the adhesive exposes a layer of the first multi-layer plating from the adhesive.

19. The system as claimed in claim 16 wherein the adhesive exposes only a lower-most layer of the first multi-layer plating from the adhesive.

20. The system as claimed in claim 16 wherein the external bond fingers include a second multi-layer plating having a first layer of about 0.003 μm gold, a second layer of about 0.1 μm palladium, a third layer of about 5.0 μm nickel, and a fourth layer of about 0.5 μm palladium.