Integrated circuit package system with wire-in-film isolation barrier and method for manufacturing thereof
View Patent ↗A method for manufacturing an integrated circuit package in package system includes: providing a substrate having a first wire-bonded die with an active side mounted above; connecting the active side of the first wire-bonded die to the substrate with a bond-wire; mounting a wire-in-film adhesive having an isolation barrier over the first wire-bonded die; and encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive with an encapsulation.
1. An integrated circuit package in package system comprising:
a substrate having a first wire-bonded die with an active side mounted above;
a bond-wire connecting the active side of the first wire-bonded die to the substrate;
a wire-in-film adhesive having an isolation barrier mounted over the first wire-bonded die, the isolation barrier includes a gradient density barrier with a substantially linear density progression; and
an encapsulation encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive.
2. The system as claimed in claim 1 wherein:
the wire-in-film adhesive includes multiple layers of wire-in-film adhesive.
3. An integrated circuit package in package system comprising:
a substrate having a first wire-bonded die with an active side mounted above;
a bond-wire connecting the active side of the first wire-bonded die to the substrate;
a wire-in-film adhesive having an isolation barrier mounted over the first wire-bonded die, the isolation barrier includes a gradient density barrier with a substantially exponential density progression; and
an encapsulation encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive.
4. An integrated circuit package in package system comprising:
a substrate having a first wire-bonded die with an active side mounted above;
a bond-wire connecting the active side of the first wire-bonded die to the substrate;
a wire-in-film adhesive having an isolation barrier mounted over the first wire-bonded die;
an encapsulation encapsulating the first wire-bonded die, the bond-wires, and the wire-in-film adhesive;
a structure mounted over the first wire-bonded die and the isolation barrier; wherein:
the isolation barrier is a compound density isolation barrier, the compound density isolation barrier includes an insulating grid; and
the structure is connected to the substrate with the bond-wires.
5. The system as claimed in claim 4 wherein:
the compound density isolation barrier includes an insulating spacer.
6. The system as claimed in claim 4 wherein:
the compound density isolation barrier includes insulating spheres.
7. The system a claimed in claim 4 wherein:
the compound density isolation barrier includes an insulating sheet.
8. The system as claimed in claim 3 wherein:
the wire-in-film adhesive includes multiple layers of wire-in-film adhesive.