Semiconductor device and method of forming RDL wider than contact pad along first axis and narrower than contact pad along second axis
A semiconductor device has a semiconductor die and first conductive layer formed over a surface of the semiconductor die. A first insulating layer is formed over the surface of the semiconductor die. A second insulating layer is formed over the first insulating layer and first conductive layer. An opening is formed in the second insulating layer over the first conductive layer. A second conductive layer is formed in the opening over the first conductive layer and second insulating layer. The second conductive layer has a width that is less than a width of the first conductive layer along a first axis. The second conductive layer has a width that is greater than a width of the first conductive layer along a second axis perpendicular to the first axis. A third insulating layer is formed over the second conductive layer and first insulating layer.
1. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a first conductive layer over a surface of the semiconductor die;
forming a first insulating layer over the surface of the semiconductor die;
forming a second insulating layer over the first insulating layer and first conductive layer;
forming an opening in the second insulating layer over the first conductive layer, the opening extending beyond the first conductive layer over first and second opposing edges of the first conductive layer while the second insulating layer overlies the first conductive layer with respect to third and fourth opposing edges of the first conductive layer perpendicular to the first and second opposing edges of the first conductive layer;
forming a second conductive layer over the first and second insulating layers and over a portion of the first conductive layer within the opening in the second insulating layer; and
forming a third insulating layer over the second conductive layer and first and second insulating layers.
2. The method of claim 1 , wherein the opening in the second insulating layer extends beyond the first and second opposing edges of the first conductive layer by 10-20 micrometers.
3. The method of claim 1 , wherein the second insulating layer overlies the first conductive layer with respect to the third and fourth opposing edges of the first conductive layer by 10-20 micrometers.
4. The method of claim 1 , wherein a width of the second conductive layer is greater than a width of the first conductive layer between the first and second opposing edges of the first conductive layer, and a width of the second conductive layer is less than a width of the first conductive layer between the third and fourth opposing edges of the first conductive layer.
5. The method of claim 1 , wherein a width of a contact interface between the first conductive layer and second conductive layer ranges from 20-40 micrometers.
6. The method of claim 1 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
7. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a first conductive layer over a surface of the semiconductor die;
forming a first insulating layer including an opening over the first conductive layer;
forming a second conductive layer within the opening over the first conductive layer, the second conductive layer including a width that is less than a width of the first conductive layer along a first axis and a width that is greater than a width of the first conductive layer along a second axis perpendicular to the first axis; and
forming a second insulating layer over the second conductive layer and first insulating layer.
8. The method of claim 7 , further including forming the opening in the first insulating layer extending beyond the first conductive layer over first and second opposing edges of the first conductive layer while the second insulating layer overlies the first conductive layer with respect to third and fourth opposing edges of the first conductive layer perpendicular to the first and second opposing edges of the first conductive layer.
9. The method of claim 7 , further including forming a third insulating layer over the surface of the semiconductor die prior to forming the first insulating layer.
10. The method of claim 7 , wherein the width of the second conductive layer is greater than the width of the first conductive layer along the second axis by 10-20 micrometers.
11. The method of claim 7 , wherein the width of the first conductive layer is greater than the width of the second conductive layer along the first axis by 10-20 micrometers.
12. The method of claim 7 , wherein a width of a contact interface between the first conductive layer and second conductive layer ranges from 20-40 micrometers.
13. The method of claim 7 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
14. A method of making a semiconductor device, comprising:
providing a semiconductor die;
forming a first conductive layer over a surface of the semiconductor die;
forming a first insulating layer over the semiconductor die; and
forming a second conductive layer over the first conductive layer that is wider than the first conductive layer along a first axis and narrower than the first conductive layer along a second axis perpendicular to the first axis.
15. The method of claim 14 , further including:
forming a second insulating layer over the surface of the semiconductor die prior to forming the first insulating layer; and
forming a third insulating layer over the second conductive layer and first insulating layer.
16. The method of claim 14 , further including forming an opening in the first insulating layer over the first conductive layer, the opening extending beyond the first conductive layer on first and second opposing edges of the first conductive layer while the first insulating layer overlies the first conductive layer with respect to third and fourth opposing edges of the first conductive layer perpendicular to the first and second opposing edges of the first conductive layer.
17. The method of claim 14 , wherein a width of the second conductive layer is greater than a width of the first conductive layer along the first axis by 10-20 micrometers.
18. The method of claim 14 , wherein a width of the second conductive layer is less than a width of the first conductive layer along the second axis by 10-20 micrometers.
19. The method of claim 14 , wherein a width of a contact interface between the first conductive layer and second conductive layer ranges from 20-40 micrometers.
20. The method of claim 14 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.
21. A semiconductor device, comprising:
a semiconductor die;
a first conductive layer formed over a surface of the semiconductor die;
a first insulating layer formed over the surface of the semiconductor die; and
a second conductive layer formed over the first conductive layer that is wider than the first conductive layer along a first axis and narrower than the first conductive layer along a second axis perpendicular to the first axis.
22. The semiconductor device of claim 21 , wherein a width of the second conductive layer is greater than a width of the first conductive layer along the first axis by 10-20 micrometers.
23. The semiconductor device of claim 21 , wherein a width of the second conductive layer is less than a width of the first conductive layer along the second axis by 10-20 micrometers.
24. The semiconductor device of claim 21 , wherein a width of a contact interface between the first conductive layer and second conductive layer ranges from 20-40 micrometers.
25. The semiconductor device of claim 21 , wherein a pitch of the first conductive layer ranges from 30-50 micrometers.