Leadless package system having external contacts

1. A leadless package system, comprising:

an integrated circuit die having contact pads;

external contact terminals with a conductive layer and an external coating layer;

connections between contact pads in the integrated circuit die and the external contact terminals; and

an encapsulant encapsulates the integrated circuit die and the external contact terminals, wherein the encapsulant is directly on a non-horizontal side of the conductive layer and partially directly on the external coating layer, and bottom portions of the conductive layer and the external coating layer extending below the encapsulant.

2. The system as claimed in claim 1 further comprising a die attach pad with a T-shape profile having the integrated circuit die attached thereto.

3. The system as claimed in claim 1 further comprising a die attach pad with a T-shape profile having the integrated circuit die attached thereto wherein the die attach pad has a protrusion.

4. The system as claimed in claim 1 wherein the external contact terminals include the external coating layer with extensions.

5. The system as claimed in claim 1 further comprising a die attach pad with a T-shape profile wherein the die attach pad includes extensions.

6. The system as claimed in claim 1 wherein the external contact terminals include an internal coating layer.

7. The system as claimed in claim 6 wherein the integrated circuit die is connected to the external contact terminals using bond wires.

8. The system as claimed in claim 6 wherein the integrated circuit die is connected to the external contact terminals using solder balls.

9. The system as claimed in claim 6 wherein the integrated circuit die is connected to a die attach pad.

10. The system as claimed in claim 6 further comprising:

a flip-chip integrated circuit die connected to the external contact terminals by solder balls; and

wherein:

the integrated circuit die is stacked on top of the flip-chip integrated circuit die.