Integrated circuit packaging system with a component in an encapsulant cavity and method of fabrication thereof
A method for fabricating an encapsulant cavity integrated circuit package system includes: providing an interposer; forming a first integrated circuit package with an inverted bottom terminal having an encapsulant cavity and the interposer; and attaching a component on the interposer in the encapsulant cavity.
1. A method for fabricating an encapsulant cavity integrated circuit package system comprising:
providing an interposer;
forming a first integrated circuit package, with an inverted bottom terminal, having an integrated circuit, an encapsulant cavity, and the interposer; and
attaching a component on the interposer in the encapsulant cavity, the integrated circuit electrically connected to a side of the interposer facing away from the component.
2. The method as claimed in claim 1 wherein attaching the component comprises attaching system device packages having surface-mount package technology.
3. The method as claimed in claim 1 wherein attaching the component comprises attaching system devices having chip-scale package technology.
4. The method as claimed in claim 1 wherein forming the first integrated circuit package system having the interposer includes providing the interposer having bond fingers along a perimeter of the interposer and inner pads with terminal pads between the bond fingers and the terminal pads.
5. The method as claimed in claim 1 wherein:
forming the first integrated circuit package system having the interposer includes providing the interposer having bond fingers along a perimeter of the interposer and inner pads with terminal pads between the bond fingers and the terminal pads; and
further comprising:
mounting a leadless package having a die paddle and a lead with the die paddle on the inner pads and the lead on the terminal pads.
6. An encapsulant cavity integrated circuit package system comprising:
an interposer;
a first integrated circuit package, with an inverted bottom terminal, having an integrated circuit, an encapsulant cavity, and the interposer; and
a component on the interposer in the encapsulant cavity, the integrated circuit electrically connected to a side of the interposer facing away from the component.
7. The system as claimed in claim 6 wherein the component comprises system device packages having surface-mount package technology.
8. The system as claimed in claim 6 wherein the component comprises system devices having chip-scale package technology.
9. The method as claimed in claim 6 wherein the interposer includes bond fingers along a perimeter of the interposer and inner pads with terminal pads between the bond fingers and the terminal pads.
10. The method as claimed in claim 6 wherein:
the interposer includes bond fingers along a perimeter of the interposer and inner pads with terminal pads between the bond fingers and the terminal pads; and
further comprising:
a leadless package having a die paddle and a lead with the die paddle on the inner pads and the lead on the terminal pads.