Integrated circuit package system with encapsulation lock
View Patent ↗An integrated circuit package system includes an external interconnect having a lead tip and a lead body, including a recess in the lead body including a first recess segment, having an orientation substantially parallel to the lengthwise dimension of the lead body, and a second recess segment intersecting and perpendicular to the first recess segment along a lead body top surface of the lead body, the first recess segment at a bottom portion of the second recess segment; an internal interconnect between an integrated circuit die and the external interconnect; and an encapsulation to cover the external interconnect with the recess filled.
1. An integrated circuit package system comprising:
an external interconnect having a lead tip and a lead body, including a recess in the lead body including a first recess segment, having an ellipsoidal shape and an orientation substantially parallel to the lengthwise dimension of the lead body, a second recess segment intersecting and extending perpendicularly outward on opposite sides of the first recess segment along the lead body top surface of the lead body, the top of the first recess segment and the top of the second recess segment coplanar with the lead body top surface, and the first recess segment at a bottom portion of the second recess segment;
another of the external interconnect having a similar configuration as the external interconnect;
an internal interconnect between an integrated circuit die and the external interconnect; and
an encapsulation to cover the external interconnect and another of the external interconnect with the recess filled;
wherein the recess has the first recess segment and the second recess segment includes a perimeter of the first recess segment and the second recess segment on the lead body top surface;
wherein: the external interconnect is a lead having the lead tip and the lead body;
the recess has intersecting recess segments in the lead body from the lead body top surface includes the recess spaced away from an edge, substantially parallel to the length-wise dimension, of the lead body top surface;
the internal interconnect is on an active side of the integrated circuit die and connected to the external interconnect;
the encapsulation is a cover for the external interconnect and a filler in the recess; and further comprising:
a tie bar next to the external interconnect; and
a paddle below the integrated circuit die.
2. The system as claimed in claim 1 wherein the internal interconnect is a solder bump between the integrated circuit die and the lead tip.
3. The system as claimed in claim 1 wherein the internal interconnect is a bond wire between the integrated circuit die and the lead tip.
4. The system as claimed in claim 1 wherein the encapsulation is a cover for the integrated circuit die.
5. The system as claimed in claim 1 wherein the tie bar is connected to the paddle.
6. The system as claimed in claim 1 wherein the external interconnect having the lead tip and the lead body has a lead tip bottom surface above and a lead body bottom surface.
7. The system as claimed in claim 1 wherein the encapsulation has the lead body at a lead body bottom surface exposed and the lead tip covered.
8. The system as claimed in claim 1 wherein the encapsulation is a cover for the tie bar and the paddle.