Liner-free tungsten contact
View Patent ↗An electrical structure comprises a dielectric layer present on a semiconductor substrate. A contact opening is present through the dielectric layer. A nickel-tungsten alloy silicide is formed over the semiconductor substrate within the contact opening. A tungsten-containing nucleation layer formed within the contact opening covers the nickel-tungsten alloy silicide and at least a portion of a sidewall of the contact opening. A tungsten contact is formed within the contact opening and separated from the nickel-tungsten alloy silicide and at least a portion of the sidewall by the tungsten-containing nucleation layer.
1. A structure for a semiconductor device, the structure comprising:
a nickel-tungsten silicide formed on a conductive region of a semiconductor substrate;
a dielectric layer present on the semiconductor substrate; and
a tungsten contact electrically coupled to the conductive region and formed through the dielectric layer and separated from the nickel-tungsten silicide and at least a portion of a sidewall of the dielectric layer by a tungsten-containing layer, wherein the tungsten-containing layer is in direct contact with the portion of the sidewall and the nickel-tungsten silicide, and wherein the nickel-tungsten silicide is formed via diffusion of tungsten from a metal layer that includes at least five atomic percent (5 at. %) tungsten and no more than thirty atomic percent (30 at. %) tungsten.
2. The structure of claim 1 , wherein a majority portion of tungsten in the nickel-tungsten silicide resides in a region nearer a surface of the nickel-tungsten silicide than a majority portion of nickel in the nickel-tungsten silicide.
3. The structure of claim 1 , wherein a thickness of a surface region of the nickel-tungsten silicide is less than or equal to about twenty percent (20%) of a thickness of the silicide and a composition of the surface region comprises at least fifty percent (50%) of the tungsten contained in the nickel-tungsten silicide.
4. The structure of claim 1 , wherein the tungsten-containing layer contains one or more of tungsten, tungsten carbide, tungsten carbonitride, and tungsten nitride.
5. The structure of claim 1 , wherein the tungsten-containing layer has a thickness between five and thirty angstroms.
6. The structure of claim 1 , further comprising a tungsten nucleation layer between the tungsten-containing layer and the tungsten contact.
7. The structure of claim 1 , wherein the tungsten-containing layer is formed utilizing a non-halogen (fluorine-free) organometallic tungsten precursor and a reducing agent.