Back to back resistive random access memory cells
A resistive random access memory cell formed in an integrated circuit includes first and second resistive random access memory devices, each including an anode and a cathode. The anode of the second resistive random access memory device is connected to the anode of the first resistive random access memory device. A programming transistor has a first source/drain terminal connected to a programming potential node, a second source/drain terminal connected to the anodes of the first and second resistive random access memory devices, and a gate connected to a program-enable node.
1. A resistive random access memory cell formed in an integrated circuit comprising:
a first resistive random access memory device including an anode and a cathode;
a second resistive random access memory device including an anode and a cathode, the anode of the second resistive random access memory device connected to the anode of the first resistive random access memory device; and
a programming transistor having a first source/drain terminal connected to a programming potential node, a second source/drain terminal connected to the anodes of the first and second resistive random access memory devices, and a gate connected to a program-enable node.
2. The resistive random access memory cell of claim 1 , further including at least one switch transistor having a gate connected to the anodes of the first and second resistive random access memory devices.
3. The resistive random access memory cell of claim 2 wherein the at least one switch transistor having a gate connected to the anode of the first resistive random access memory device and the cathode of the second resistive random access memory device comprises a plurality of switch transistors each having a gate connected to the anode of the first resistive random access memory device and the cathode of the second resistive random access memory device.
4. The resistive random access memory cell of claim 1 , further comprising:
a first programmable circuit node connected to the cathode of the first resistive random access memory device; and
a second programmable circuit node connected to the cathode of the second resistive random access memory device.
5. The resistive random access memory cell of claim 1 wherein:
the anodes of the first and second resistive random access memory devices are connected to a segment of a first metal layer in the integrated circuit; and
the cathode of the first and second resistive random access memory devices and the cathode of the second resistive random access memory devices are connected to different segments of a second metal layer disposed above the first metal layer in the integrated circuit.
6. The resistive random access memory cell of claim 5 wherein the first metal layer is the lowest metal layer in the integrated circuit.
7. The resistive random access memory cell of claim 6 wherein the second metal layer is the second lowest metal layer in the integrated circuit.