Reducing wafer bonding misalignment by varying thermal treatment prior to bonding
View Patent ↗A bonding layer of a first wafer article is thermally treated and a bonding layer of a second wafer article is thermally treated in accordance with first and second process parameters, respectively prior to bonding the first wafer article with the second wafer article. First and second grid distortion in the first and second wafer articles is measured and a difference is determined between the first and second grid distortions. A prediction is made for maintaining the difference within a prescribed tolerance. At least one of the first process parameters and the second process parameters is conditionally varied in accordance with the prediction. The thermal treating of the first and second wafer articles can then be performed with respect to another pair of the first and second wafer articles prior to bonding to one another through their respective bonding layers.
1. A system for bonding a first wafer article with a second wafer article, comprising:
a processor; and
a memory having a set of instructions recorded thereon which can be carried out by the processor to cause:
thermally treating a bonding layer of a first wafer article in accordance with first process parameters, and thermally treating a bonding layer of a second wafer article in accordance with second process parameters;
measuring first and second grid distortion in the first and second wafer articles, respectively, determining a difference between the first and second grid distortions and determining a prediction for maintaining the difference within a prescribed tolerance;
conditionally varying at least one of the first process parameters and the second process parameters in accordance with the prediction;
performing the thermally treating of the first wafer article and the thermally treating of the second wafer article with respect to another pair of the first and second wafer articles after the conditionally varying of the process parameters; and
bonding the another pair of wafer articles to one another through their respective bonding layers.
2. The system of claim 1 , wherein the conditionally varying of the process parameters includes omitting the thermal treatment of the bonding layer of the second wafer article.
3. The system of claim 1 , wherein each of the first process parameters and the second process parameters include parameters for illumination, temperature and heating time and the conditionally varying varies a parameter selected from at least one of: the illumination, the temperature and the heating time of at least one of the first process parameters or of the second process parameters.
4. The system of claim 1 , wherein in addition the instructions can be carried out by the processor to perform with respect to the another pair of wafer articles:
repeating the measuring of the first and second grid distortion, determining the difference and determining the prediction for reducing the difference, and with respect to a further pair of the wafer articles repeating the conditionally varying of the process parameters, and the thermally treating of the first wafer and the thermally treating of the second wafer of the further pair of wafer articles after the conditionally varying of the process parameters, and
repeating the additionally performing with respect to each such further pair of wafer articles and each such pair of wafer articles following the further pair of wafer articles.
5. The system of claim 1 , wherein the first wafer article includes a first active semiconductor device region disposed at a first level of the first wafer article and a second active semiconductor device region disposed at a second level of the first wafer article separated from the first level of the first wafer article in a vertical direction.